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XCZU9CG-1FFVB1156I

-40°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC CG Series 328 I/O

Manufacturer: Xilinx Inc.
Origchip NO: 903-XCZU9CG-1FFVB1156I
Package: 1156-BBGA, FCBGA
Datasheet: PDF
Stock: 474
Description: -40°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC CG Series 328 I/O(Kg)

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Parameters
Factory Lead Time	11 Weeks
Package / Case	1156-BBGA, FCBGA
Operating Temperature	-40°C~100°C TJ
Packaging	Tray
Published	2013
Series	Zynq® UltraScale+™ MPSoC CG
Part Status	Active
Moisture Sensitivity Level (MSL)	4 (72 Hours)
HTS Code	8542.31.00.01
Peak Reflow Temperature (Cel)	NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s)	NOT SPECIFIED
Number of I/O	328
Speed	500MHz, 1.2GHz
RAM Size	256KB
Core Processor	Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Peripherals	DMA, WDT
Connectivity	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture	MCU, FPGA
Primary Attributes	Zynq®UltraScale+™ FPGA, 599K+ Logic Cells
RoHS Status	ROHS3 Compliant

This SoC is built on Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? core processor(s).

A core processor(s) Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? is integrated into this SoC.Its package is 1156-BBGA, FCBGA.As this SoC chip has 256KB RAM implemented, it provides reliable performance to its users.A MCU, FPGA technique is used for the SoC design's internal architecture.A system on chip SoC of this type belongs to the Zynq? UltraScale+? MPSoC CG series.For this SoC meaning, the average operating temperature should be -40°C~100°C TJ.It is important to note that this SoC security combines Zynq?UltraScale+? FPGA, 599K+ Logic Cells.Featured in the state-of-the-art Tray package, this SoC system on a chip provides outstanding performance.As a whole, this SoC part includes 328 I/Os.