All Products

View All >>

XCZU7CG-2FFVC1156E

0°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC CG Series 360 I/O

Manufacturer: Xilinx Inc.
Origchip NO: 903-XCZU7CG-2FFVC1156E
Package: 1156-BBGA, FCBGA
Datasheet: PDF
Stock: 758
Description: 0°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC CG Series 360 I/O(Kg)

Purchase & Inquiry

Transport

Purchase

You may place an order without registering to XINJIADA.
We strongly suggest you sign in before purchasing as you can track your order in real time.

Means of Payment

For your convenience, we accept multiple payment methods in USD, including PayPal, Credit Card, and wire transfer.

RFQ (Request for Quotations)

It is recommended to request for quotations to get the latest prices and inventories about the part.
Our sales will reply to your request by email within 24 hours.

IMPORTANT NOTICE

1. You'll receive an order information email in your inbox. (Please remember to check the spam folder if you didn't hear from us).
2. Since inventories and prices may fluctuate to some extent, the sales manager is going to reconfirm the order and let you know if there are any updates.

Shipping Cost

Shipping starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.)
The basic freight (for package ≤0.5kg or corresponding volume) depends on the time zone and country.

Shipping Method

Currently, our products are shipped through DHL, FedEx, SF, and UPS.

Delivery Time

Once the goods are shipped, estimated delivery time depends on the shipping methods you chose:

FedEx International, 5-7 business days.

The following are some common countries' logistic time.
transport

Details

Tags

Parameters
Factory Lead Time	11 Weeks
Package / Case	1156-BBGA, FCBGA
Operating Temperature	0°C~100°C TJ
Packaging	Tray
Published	2016
Series	Zynq® UltraScale+™ MPSoC CG
Pbfree Code	yes
Part Status	Active
Moisture Sensitivity Level (MSL)	4 (72 Hours)
HTS Code	8542.31.00.01
Peak Reflow Temperature (Cel)	NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s)	NOT SPECIFIED
Number of I/O	360
Speed	533MHz, 1.3GHz
RAM Size	256KB
Core Processor	Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Peripherals	DMA, WDT
Connectivity	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture	MCU, FPGA
Primary Attributes	Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
RoHS Status	ROHS3 Compliant

This SoC is built on Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? core processor(s).

There are Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? core processors in this SoC.There is a 1156-BBGA, FCBGA package assigned to this system on a chip by the manufacturer.As this SoC chip has 256KB RAM implemented, it provides reliable performance to its users.This SoC design employs the MCU, FPGA technique for its internal architecture.It is a member of the Zynq? UltraScale+? MPSoC CG series.Typical operating temperatures for this SoC meaning should be 0°C~100°C TJ.In addition, this SoC security combines Zynq?UltraScale+? FPGA, 504K+ Logic Cells.Tray package houses this SoC system on a chip.An integral part of this SoC consists of a total of 360 I/Os.