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XCZU7CG-1FFVF1517E

0°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC CG Series 464 I/O

Manufacturer: Xilinx Inc.
Origchip NO: 903-XCZU7CG-1FFVF1517E
Package: 1517-BBGA, FCBGA
Datasheet: PDF
Stock: 585
Description: 0°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC CG Series 464 I/O(Kg)

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Parameters
Factory Lead Time	11 Weeks
Package / Case	1517-BBGA, FCBGA
Operating Temperature	0°C~100°C TJ
Packaging	Tray
Published	2016
Series	Zynq® UltraScale+™ MPSoC CG
Part Status	Active
Moisture Sensitivity Level (MSL)	4 (72 Hours)
HTS Code	8542.31.00.01
Peak Reflow Temperature (Cel)	NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s)	NOT SPECIFIED
Number of I/O	464
Speed	500MHz, 1.2GHz
RAM Size	256KB
Core Processor	Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Peripherals	DMA, WDT
Connectivity	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture	MCU, FPGA
Primary Attributes	Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
RoHS Status	ROHS3 Compliant

This SoC is built on Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? core processor(s).

There are Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? core processors in this SoC.Package 1517-BBGA, FCBGA is assigned to this system on a chip by the manufacturer.With 256KB RAM implemented, this SoC chip provides reliable operation.This SoC design employs the MCU, FPGA technique for its internal architecture.Featured system on chip SoCs of the Zynq? UltraScale+? MPSoC CG series.This SoC meaning should have an average operating temperature of 0°C~100°C TJ.It is important to note that this SoC security combines Zynq?UltraScale+? FPGA, 504K+ Logic Cells.Tray package houses this SoC system on a chip.464 I/Os in total are included in this SoC part.