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XCZU6EG-L1FFVC900I

900 Terminations-40°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC EG Series 204 I/O0.72V


  • Manufacturer: Xilinx Inc.
  • Origchip NO: 903-XCZU6EG-L1FFVC900I
  • Package: 900-BBGA, FCBGA
  • Datasheet: PDF
  • Stock: 289
  • Description: 900 Terminations-40°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC EG Series 204 I/O0.72V (Kg)

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Details

Tags

Parameters
Factory Lead Time 11 Weeks
Package / Case 900-BBGA, FCBGA
Surface Mount YES
Operating Temperature -40°C~100°C TJ
Packaging Tray
Published 2016
Series Zynq® UltraScale+™ MPSoC EG
Part Status Active
Moisture Sensitivity Level (MSL) 4 (72 Hours)
Number of Terminations 900
Additional Feature ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY
HTS Code 8542.31.00.01
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 0.72V
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code R-PBGA-B900
Supply Voltage-Max (Vsup) 0.742V
Supply Voltage-Min (Vsup) 0.698V
Number of I/O 204
Speed 500MHz, 600MHz, 1.2GHz
RAM Size 256KB
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Primary Attributes Zynq®UltraScale+™ FPGA, 469K+ Logic Cells
RoHS Status ROHS3 Compliant

This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s).


Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s) are used in the construction of this SoC.The manufacturer assigns this system on a chip with a 900-BBGA, FCBGA package.The SoC chip provides users with reliable performance because it is implemented with 256KB RAM.The internal architecture of this SoC design is based on the MCU, FPGA technique.It is part of the Zynq? UltraScale+? MPSoC EG series of system on a chips.In general, this SoC meaning should operate at a temperature of -40°C~100°C TJ on a regular basis.Taking note of the fact that this SoC security combines Zynq?UltraScale+? FPGA, 469K+ Logic Cells is important.Tray package houses this SoC system on a chip.204 I/Os are available in this SoC part.Use a power supply with a voltage of 0.72V if possible.The SoCs wireless cannot operate at a voltage greater than 0.742V because it is considered unsafe for the application.As a minimum, the power supply of the SoC system on a chip needs to be 0.698V.system on a chip benefits from 900 terminations.For its uPs/uCs/peripheral SoCs, it uses MICROPROCESSOR CIRCUIT.Aside from that, this SoC processor is also equipped with some additional features that are present in ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY.

Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 processor.


256KB RAM.
Built on MCU, FPGA.
MICROPROCESSOR CIRCUIT
ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

There are a lot of Xilinx Inc.


XCZU6EG-L1FFVC900I System On Chip (SoC) applications.

  • Apple smart watch
  • Automotive
  • Industrial sectors
  • Robotics
  • Healthcare
  • AC drive control module
  • Measurement testers
  • Networked sensors
  • Cyber security for critical applications in the aerospace
  • Embedded systems
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