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XCZU6EG-2FFVB1156I

-40°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC EG Series 328 I/O

Manufacturer: Xilinx Inc.
Origchip NO: 903-XCZU6EG-2FFVB1156I
Package: 1156-BBGA, FCBGA
Datasheet: PDF
Stock: 105
Description: -40°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC EG Series 328 I/O(Kg)

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Details

Tags

Parameters
Package / Case	1156-BBGA, FCBGA
Operating Temperature	-40°C~100°C TJ
Packaging	Tray
Series	Zynq® UltraScale+™ MPSoC EG
Part Status	Active
Moisture Sensitivity Level (MSL)	4 (72 Hours)
HTS Code	8542.31.00.01
Peak Reflow Temperature (Cel)	NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s)	NOT SPECIFIED
Number of I/O	328
Speed	533MHz, 600MHz, 1.3GHz
RAM Size	256KB
Core Processor	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Peripherals	DMA, WDT
Connectivity	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture	MCU, FPGA
Primary Attributes	Zynq®UltraScale+™ FPGA, 469K+ Logic Cells
RoHS Status	ROHS3 Compliant
Factory Lead Time	11 Weeks

This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s).

A core processor Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 is used to build this SoC.The manufacturer assigns this system on a chip with a 1156-BBGA, FCBGA package as per the manufacturer's specifications.The 256KB RAM implementation of this SoC chip ensures efficient performance for users.Internally, this SoC design uses the MCU, FPGA technique.Featured system on chip SoCs of the Zynq? UltraScale+? MPSoC EG series.The average operating temps for this SoC meaning should be -40°C~100°C TJ.This SoC security combines Zynq?UltraScale+? FPGA, 469K+ Logic Cells, an important feature to keep in mind.It comes in a state-of-the-art Tray package.As a whole, this SoC part is comprised of 328 inputs and outputs.