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XCZU5EV-1SFVC784E

0°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC EV Series 252 I/O

Manufacturer: Xilinx Inc.
Origchip NO: 903-XCZU5EV-1SFVC784E
Package: 784-BFBGA, FCBGA
Datasheet: PDF
Stock: 515
Description: 0°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC EV Series 252 I/O(Kg)

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Details

Tags

Parameters
Factory Lead Time	11 Weeks
Package / Case	784-BFBGA, FCBGA
Supplier Device Package	784-FCBGA (23x23)
Operating Temperature	0°C~100°C TJ
Packaging	Tray
Published	2016
Series	Zynq® UltraScale+™ MPSoC EV
Part Status	Active
Moisture Sensitivity Level (MSL)	4 (72 Hours)
Number of I/O	252
Speed	500MHz, 600MHz, 1.2GHz
RAM Size	256KB
Core Processor	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Peripherals	DMA, WDT
Connectivity	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture	MCU, FPGA
Primary Attributes	Zynq®UltraScale+™ FPGA, 256K+ Logic Cells
RoHS Status	ROHS3 Compliant

This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s).

A Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s) is built into this SoC.It has been assigned a package 784-BFBGA, FCBGA by its manufacturer for this system on a chip.As this SoC chip has 256KB RAM implemented, it provides reliable performance to its users.The SoC design uses MCU, FPGA architecture for its internal architecture.In the Zynq? UltraScale+? MPSoC EV series, this system on chip SoC is included.It is expected that this SoC meaning will operate at 0°C~100°C TJ on average.This SoC security combines Zynq?UltraScale+? FPGA, 256K+ Logic Cells and that is something to note.A state-of-the-art Tray package houses this SoC system on a chip.252 I/Os are available in this SoC part.