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XCZU4EV-L2SFVC784E

0°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC EV Series 252 I/O

Manufacturer: Xilinx Inc.
Origchip NO: 903-XCZU4EV-L2SFVC784E
Package: 784-BFBGA, FCBGA
Datasheet: PDF
Stock: 203
Description: 0°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC EV Series 252 I/O(Kg)

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Details

Tags

Parameters
Factory Lead Time	11 Weeks
Package / Case	784-BFBGA, FCBGA
Supplier Device Package	784-FCBGA (23x23)
Operating Temperature	0°C~100°C TJ
Packaging	Tray
Published	2016
Series	Zynq® UltraScale+™ MPSoC EV
Part Status	Active
Moisture Sensitivity Level (MSL)	4 (72 Hours)
Number of I/O	252
Speed	533MHz, 600MHz, 1.3GHz
RAM Size	256KB
Core Processor	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Peripherals	DMA, WDT
Connectivity	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture	MCU, FPGA
Primary Attributes	Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
RoHS Status	ROHS3 Compliant

This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s).

Based on the core processor(s) Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2, this SoC is built.According to the manufacturer, this system on a chip has a package of 784-BFBGA, FCBGA.This SoC chip is equipped with 256KB RAM and guarantees reliable performance to the user.In terms of internal architecture, this SoC design uses the MCU, FPGA method.Zynq? UltraScale+? MPSoC EV is the series in which this system on chip SoC falls under.It is expected that this SoC meaning will operate at 0°C~100°C TJ on average.It is important to note that this SoC security combines Zynq?UltraScale+? FPGA, 192K+ Logic Cells.In the state-of-the-art Tray package, this SoC system on a chip is housed.252 I/Os in total are included in this SoC part.