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XCZU4EV-3FBVB900E

0°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC EV Series 204 I/O

Manufacturer: Xilinx Inc.
Origchip NO: 903-XCZU4EV-3FBVB900E
Package: 900-BBGA, FCBGA
Datasheet: PDF
Stock: 679
Description: 0°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC EV Series 204 I/O(Kg)

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Details

Tags

Parameters
Factory Lead Time	11 Weeks
Package / Case	900-BBGA, FCBGA
Operating Temperature	0°C~100°C TJ
Packaging	Tray
Published	2016
Series	Zynq® UltraScale+™ MPSoC EV
Part Status	Active
Moisture Sensitivity Level (MSL)	4 (72 Hours)
HTS Code	8542.31.00.01
Peak Reflow Temperature (Cel)	NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s)	NOT SPECIFIED
Number of I/O	204
Speed	600MHz, 1.5GHz
RAM Size	256KB
Core Processor	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Peripherals	DMA, WDT
Connectivity	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture	MCU, FPGA
Primary Attributes	Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
RoHS Status	ROHS3 Compliant

This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? core processor(s).

This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? core processor(s).Package 900-BBGA, FCBGA is assigned to this system on a chip by the manufacturer.Users will enjoy reliable performance with this SoC chip, which has implemented 256KB RAM.In terms of internal architecture, this SoC design uses the MCU, FPGA method.Zynq? UltraScale+? MPSoC EV is the series in which this system on chip SoC falls under.For this SoC meaning, the average operating temperature should be 0°C~100°C TJ.This SoC security combines Zynq?UltraScale+? FPGA, 192K+ Logic Cells, an important feature to keep in mind.This SoC system on a chip has been designed in a state-of-the-art Tray package.Total I/Os on this SoC part are 204.