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XCZU4EV-1FBVB900E

0°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC EV Series 204 I/O

Manufacturer: Xilinx Inc.
Origchip NO: 903-XCZU4EV-1FBVB900E
Package: 900-BBGA, FCBGA
Datasheet: PDF
Stock: 236
Description: 0°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC EV Series 204 I/O(Kg)

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Parameters
Factory Lead Time	11 Weeks
Package / Case	900-BBGA, FCBGA
Operating Temperature	0°C~100°C TJ
Packaging	Tray
Published	2016
Series	Zynq® UltraScale+™ MPSoC EV
Part Status	Active
Moisture Sensitivity Level (MSL)	4 (72 Hours)
HTS Code	8542.31.00.01
Peak Reflow Temperature (Cel)	NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s)	NOT SPECIFIED
Number of I/O	204
Speed	500MHz, 600MHz, 1.2GHz
RAM Size	256KB
Core Processor	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Peripherals	DMA, WDT
Connectivity	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture	MCU, FPGA
Primary Attributes	Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
RoHS Status	ROHS3 Compliant

This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s).

A core processor(s) Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 is integrated into this SoC.There is a 900-BBGA, FCBGA package assigned to this system on a chip by the manufacturer.A SoC chip with 256KB RAM is provided for users to enjoy reliable performance.The SoC design uses MCU, FPGA architecture for its internal architecture.Featured system on chip SoCs of the Zynq? UltraScale+? MPSoC EV series.This SoC meaning should have an average operating temperature of 0°C~100°C TJ.A significant feature of this SoC security is the combination of Zynq?UltraScale+? FPGA, 192K+ Logic Cells.Housed in the state-of-art Tray package.204 I/Os in total are included in this SoC part.