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XCZU4CG-1SFVC784I

-40°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC CG Series 252 I/O

Manufacturer: Xilinx Inc.
Origchip NO: 903-XCZU4CG-1SFVC784I
Package: 784-BFBGA, FCBGA
Datasheet: PDF
Stock: 767
Description: -40°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC CG Series 252 I/O(Kg)

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Details

Tags

Parameters
Factory Lead Time	11 Weeks
Package / Case	784-BFBGA, FCBGA
Operating Temperature	-40°C~100°C TJ
Packaging	Tray
Published	2016
Series	Zynq® UltraScale+™ MPSoC CG
Part Status	Active
Moisture Sensitivity Level (MSL)	4 (72 Hours)
HTS Code	8542.31.00.01
Peak Reflow Temperature (Cel)	NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s)	NOT SPECIFIED
Number of I/O	252
Speed	500MHz, 1.2GHz
RAM Size	256KB
Core Processor	Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Peripherals	DMA, WDT
Connectivity	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture	MCU, FPGA
Primary Attributes	Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
RoHS Status	ROHS3 Compliant

This SoC is built on Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? core processor(s).

A core processor(s) Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? is integrated into this SoC.According to the manufacturer, this system on a chip has a package of 784-BFBGA, FCBGA.The 256KB RAM implementation of this SoC chip ensures efficient performance for users.This SoC design employs the MCU, FPGA technique for its internal architecture.It is part of the Zynq? UltraScale+? MPSoC CG series of system on a chips.This SoC meaning should have an average operating temperature of -40°C~100°C TJ when it is operating normally.This SoC security combines Zynq?UltraScale+? FPGA, 192K+ Logic Cells and that is something to note.Housed in the state-of-art Tray package.252 I/Os in total are included in this SoC part.