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XCZU3CG-L1SFVC784I

784 Terminations-40°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC CG Series 252 I/O0.72V


  • Manufacturer: Xilinx Inc.
  • Origchip NO: 903-XCZU3CG-L1SFVC784I
  • Package: 784-BFBGA, FCBGA
  • Datasheet: PDF
  • Stock: 593
  • Description: 784 Terminations-40°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC CG Series 252 I/O0.72V (Kg)

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Details

Tags

Parameters
Factory Lead Time 11 Weeks
Package / Case 784-BFBGA, FCBGA
Surface Mount YES
Operating Temperature -40°C~100°C TJ
Packaging Tray
Published 2016
Series Zynq® UltraScale+™ MPSoC CG
Part Status Active
Moisture Sensitivity Level (MSL) 4 (72 Hours)
Number of Terminations 784
Additional Feature IT ALSO OPERATES AT 0.85V NOMINAL SUPPLY(PROCESSING SYSTEM)
HTS Code 8542.31.00.01
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 0.72V
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code S-PBGA-B784
Number of I/O 252
Speed 500MHz, 1.2GHz
RAM Size 256KB
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT
Core Processor Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Primary Attributes Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
RoHS Status ROHS3 Compliant

This SoC is built on Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? core processor(s).


Based on the core processor(s) Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, this SoC has been developed.Manufacturer assigns package 784-BFBGA, FCBGA to this system on a chip.The 256KB RAM implementation of this SoC chip ensures efficient performance for users.This SoC design employs the MCU, FPGA technique for its internal architecture.Zynq? UltraScale+? MPSoC CG is the series number of this system on chip SoC.As a rule of thumb, the average operating temperature for this SoC meaning should be -40°C~100°C TJ.A significant feature of this SoC security is the combination of Zynq?UltraScale+? FPGA, 154K+ Logic Cells.Tray package houses this SoC system on a chip.This SoC part contains a total of 252 I/Os in total.Ideally, a power supply with a voltage of 0.72V should be used.As a result, there are 784 terminations in total, which does really benefit system on a chip.MICROPROCESSOR CIRCUIT served as its uPs, uCs, and peripheral integrated circuits.The SoC processor also includes IT ALSO OPERATES AT 0.85V NOMINAL SUPPLY(PROCESSING SYSTEM), which are additional features.

Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? processor.


256KB RAM.
Built on MCU, FPGA.
MICROPROCESSOR CIRCUIT
IT ALSO OPERATES AT 0.85V NOMINAL SUPPLY(PROCESSING SYSTEM)

There are a lot of Xilinx Inc.


XCZU3CG-L1SFVC784I System On Chip (SoC) applications.

  • Smart appliances
  • Central inverter
  • USB hard disk enclosure
  • Industrial automation devices
  • ARM Cortex M4 microcontroller
  • Cyberphysical system-on-chip
  • Functional safety for critical applications in the aerospace
  • Efficient hardware for training of neural networks
  • Level
  • Apple smart watch
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