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XCZU2EG-3SBVA484E

484 Terminations0°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC EG Series 82 I/O0.9V

Manufacturer: Xilinx Inc.
Origchip NO: 903-XCZU2EG-3SBVA484E
Package: 484-BFBGA, FCBGA
Datasheet: PDF
Stock: 408
Description: 484 Terminations0°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC EG Series 82 I/O0.9V (Kg)

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Details

Tags

Parameters
Package / Case	484-BFBGA, FCBGA
Surface Mount	YES
Operating Temperature	0°C~100°C TJ
Packaging	Tray
Published	2013
Series	Zynq® UltraScale+™ MPSoC EG
Part Status	Obsolete
Moisture Sensitivity Level (MSL)	4 (72 Hours)
Number of Terminations	484
Technology	CMOS
Terminal Position	BOTTOM
Terminal Form	BALL
Supply Voltage	0.9V
Reach Compliance Code	compliant
JESD-30 Code	S-PBGA-B484
Number of I/O	82
Speed	600MHz, 667MHz, 1.5GHz
RAM Size	256KB
uPs/uCs/Peripheral ICs Type	MICROPROCESSOR CIRCUIT
Core Processor	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Peripherals	DMA, WDT
Connectivity	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture	MCU, FPGA
Primary Attributes	Zynq®UltraScale+™ FPGA, 103K+ Logic Cells

This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s).

A Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s) is built into this SoC.Its package is 484-BFBGA, FCBGA.With 256KB RAM implemented, this SoC chip provides reliable operation.In terms of internal architecture, this SoC design uses the MCU, FPGA method.In the Zynq? UltraScale+? MPSoC EG series, this system on chip SoC is included.Typical operating temperatures for this SoC meaning should be 0°C~100°C TJ.This SoC security combines Zynq?UltraScale+? FPGA, 103K+ Logic Cells, an important feature to keep in mind.There is a state-of-the-art Tray package that houses this SoC system on a chip.This SoC part contains a total of 82 I/Os in total.It is recommended to use a 0.9V power supply.There are 484 terminations in total and that really benefits system on a chip.This wireless SoC uses MICROPROCESSOR CIRCUIT as its uPs, uCs, and peripheral ICs.