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XCZU2EG-3SBVA484E

484 Terminations0°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC EG Series 82 I/O0.9V


  • Manufacturer: Xilinx Inc.
  • Origchip NO: 903-XCZU2EG-3SBVA484E
  • Package: 484-BFBGA, FCBGA
  • Datasheet: PDF
  • Stock: 408
  • Description: 484 Terminations0°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC EG Series 82 I/O0.9V (Kg)

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Details

Tags

Parameters
Package / Case 484-BFBGA, FCBGA
Surface Mount YES
Operating Temperature 0°C~100°C TJ
Packaging Tray
Published 2013
Series Zynq® UltraScale+™ MPSoC EG
Part Status Obsolete
Moisture Sensitivity Level (MSL) 4 (72 Hours)
Number of Terminations 484
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Supply Voltage 0.9V
Reach Compliance Code compliant
JESD-30 Code S-PBGA-B484
Number of I/O 82
Speed 600MHz, 667MHz, 1.5GHz
RAM Size 256KB
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Primary Attributes Zynq®UltraScale+™ FPGA, 103K+ Logic Cells

This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s).


A Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s) is built into this SoC.Its package is 484-BFBGA, FCBGA.With 256KB RAM implemented, this SoC chip provides reliable operation.In terms of internal architecture, this SoC design uses the MCU, FPGA method.In the Zynq? UltraScale+? MPSoC EG series, this system on chip SoC is included.Typical operating temperatures for this SoC meaning should be 0°C~100°C TJ.This SoC security combines Zynq?UltraScale+? FPGA, 103K+ Logic Cells, an important feature to keep in mind.There is a state-of-the-art Tray package that houses this SoC system on a chip.This SoC part contains a total of 82 I/Os in total.It is recommended to use a 0.9V power supply.There are 484 terminations in total and that really benefits system on a chip.This wireless SoC uses MICROPROCESSOR CIRCUIT as its uPs, uCs, and peripheral ICs.

Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 processor.


256KB RAM.
Built on MCU, FPGA.
MICROPROCESSOR CIRCUIT

There are a lot of Xilinx Inc.


XCZU2EG-3SBVA484E System On Chip (SoC) applications.

  • DC-input BLDC motor drive
  • System-on-chip (SoC)
  • POS Terminals
  • Medical Pressure
  • Cyber security for critical applications in the aerospace
  • Level
  • Multiprocessor system-on-chips (MPSoCs)
  • Industrial Pressure
  • Avionics
  • ARM processors
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