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XCZU2CG-L2SFVA625E

625 Terminations0°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC CG Series 180 I/O0.72V


  • Manufacturer: Xilinx Inc.
  • Origchip NO: 903-XCZU2CG-L2SFVA625E
  • Package: 625-BFBGA, FCBGA
  • Datasheet: PDF
  • Stock: 737
  • Description: 625 Terminations0°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC CG Series 180 I/O0.72V (Kg)

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Details

Tags

Parameters
Factory Lead Time 11 Weeks
Package / Case 625-BFBGA, FCBGA
Surface Mount YES
Operating Temperature 0°C~100°C TJ
Packaging Tray
Published 2016
Series Zynq® UltraScale+™ MPSoC CG
Part Status Active
Moisture Sensitivity Level (MSL) 4 (72 Hours)
Number of Terminations 625
Additional Feature ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY
HTS Code 8542.31.00.01
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 0.72V
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code R-PBGA-B625
Supply Voltage-Max (Vsup) 0.742V
Supply Voltage-Min (Vsup) 0.698V
Number of I/O 180
Speed 533MHz, 1.3GHz
RAM Size 256KB
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT
Core Processor Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Primary Attributes Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
RoHS Status ROHS3 Compliant

This SoC is built on Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? core processor(s).


A core processor Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? is embedded in this SoC.It has been assigned a package 625-BFBGA, FCBGA by its manufacturer for this system on a chip.This SoC chip is equipped with 256KB RAM and guarantees reliable performance to the user.The SoC design uses MCU, FPGA architecture for its internal architecture.Featured system on chip SoCs of the Zynq? UltraScale+? MPSoC CG series.This SoC meaning should have an average operating temperature of 0°C~100°C TJ when it is operating normally.It is important to note that this SoC security combines Zynq?UltraScale+? FPGA, 103K+ Logic Cells.There is a state-of-the-art Tray package that houses this SoC system on a chip.This SoC part has a total of 180 I/Os.It is recommended to use a 0.72V power supply.In the SoCs wireless, voltages above 0.742V are considered unsafe.Power supply should be at least 0.698V.A system on a chip benefits from having 625 terminations.This wireless SoC uses MICROPROCESSOR CIRCUIT as its uPs, uCs, and peripheral ICs.This SoC processor also includes ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY.

Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? processor.


256KB RAM.
Built on MCU, FPGA.
MICROPROCESSOR CIRCUIT
ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

There are a lot of Xilinx Inc.


XCZU2CG-L2SFVA625E System On Chip (SoC) applications.

  • sequence controllers
  • Central alarm system
  • AC drive control module
  • Efficient hardware for inference of neural networks
  • Industrial automation devices
  • Keywords
  • Temperature
  • Microprocessors
  • Networked sensors
  • Efficient hardware for training of neural networks
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