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XCZU2CG-1SFVA625E

0°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC CG Series 180 I/O

Manufacturer: Xilinx Inc.
Origchip NO: 903-XCZU2CG-1SFVA625E
Package: 625-BFBGA, FCBGA
Datasheet: PDF
Stock: 323
Description: 0°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC CG Series 180 I/O(Kg)

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Parameters
Factory Lead Time	11 Weeks
Package / Case	625-BFBGA, FCBGA
Operating Temperature	0°C~100°C TJ
Packaging	Tray
Published	2016
Series	Zynq® UltraScale+™ MPSoC CG
JESD-609 Code	e1
Part Status	Active
Moisture Sensitivity Level (MSL)	4 (72 Hours)
Terminal Finish	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
HTS Code	8542.31.00.01
Peak Reflow Temperature (Cel)	NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s)	NOT SPECIFIED
Number of I/O	180
Speed	500MHz, 1.2GHz
RAM Size	256KB
Core Processor	Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Peripherals	DMA, WDT
Connectivity	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture	MCU, FPGA
Primary Attributes	Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
RoHS Status	ROHS3 Compliant

This SoC is built on Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? core processor(s).

A core processor Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? is used to build this SoC.Manufacturer assigns package 625-BFBGA, FCBGA to this system on a chip.Users will enjoy reliable performance with this SoC chip, which has implemented 256KB RAM.When it comes to internal architecture, this SoC design employs the MCU, FPGA technique.Zynq? UltraScale+? MPSoC CG is the series name of this system on chip SoC.Typical operating temperatures for this SoC meaning should be 0°C~100°C TJ.There is one thing to note about this SoC security: it combines Zynq?UltraScale+? FPGA, 103K+ Logic Cells.A state-of-the-art Tray package houses this SoC system on a chip.An integral part of this SoC consists of a total of 180 I/Os.