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XCZU19EG-1FFVC1760E

0°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC EG Series 512 I/O

Manufacturer: Xilinx Inc.
Origchip NO: 903-XCZU19EG-1FFVC1760E
Package: 1760-BBGA, FCBGA
Datasheet: PDF
Stock: 187
Description: 0°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC EG Series 512 I/O(Kg)

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Parameters
Factory Lead Time	11 Weeks
Package / Case	1760-BBGA, FCBGA
Operating Temperature	0°C~100°C TJ
Packaging	Tray
Published	2016
Series	Zynq® UltraScale+™ MPSoC EG
Part Status	Active
Moisture Sensitivity Level (MSL)	4 (72 Hours)
HTS Code	8542.31.00.01
Peak Reflow Temperature (Cel)	NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s)	NOT SPECIFIED
Number of I/O	512
Speed	500MHz, 600MHz, 1.2GHz
RAM Size	256KB
Core Processor	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Peripherals	DMA, WDT
Connectivity	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture	MCU, FPGA
Primary Attributes	Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
RoHS Status	ROHS3 Compliant

This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s).

A core processor Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 is used to build this SoC.According to the manufacturer, this system on a chip has a package of 1760-BBGA, FCBGA.This SoC chip is equipped with 256KB RAM and guarantees reliable performance to the user.The SoC design uses MCU, FPGA architecture for its internal architecture.The Zynq? UltraScale+? MPSoC EG series contains this system on chip SoC.For this SoC meaning, the average operating temperature should be 0°C~100°C TJ.It is important to note that this SoC security combines Zynq?UltraScale+? FPGA, 1143K+ Logic Cells.This SoC system on a chip has been designed in a state-of-the-art Tray package.As a whole, this SoC part is comprised of 512 inputs and outputs.