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XCZU17EG-3FFVB1517E

0°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC EG Series 644 I/O

Manufacturer: Xilinx Inc.
Origchip NO: 903-XCZU17EG-3FFVB1517E
Package: 1517-BBGA, FCBGA
Datasheet: PDF
Stock: 267
Description: 0°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC EG Series 644 I/O(Kg)

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Parameters
Factory Lead Time	11 Weeks
Package / Case	1517-BBGA, FCBGA
Operating Temperature	0°C~100°C TJ
Packaging	Tray
Published	2016
Series	Zynq® UltraScale+™ MPSoC EG
Part Status	Active
Moisture Sensitivity Level (MSL)	4 (72 Hours)
HTS Code	8542.31.00.01
Peak Reflow Temperature (Cel)	NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s)	NOT SPECIFIED
Number of I/O	644
Speed	600MHz, 667MHz, 1.5GHz
RAM Size	256KB
Core Processor	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Peripherals	DMA, WDT
Connectivity	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture	MCU, FPGA
Primary Attributes	Zynq®UltraScale+™ FPGA, 926K+ Logic Cells
RoHS Status	ROHS3 Compliant

This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s).

There are Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processors in this SoC.There is a 1517-BBGA, FCBGA package assigned to this system on a chip by the manufacturer.A 256KB RAM SoC chip provides reliable performance to users.The SoC design uses MCU, FPGA architecture for its internal architecture.A system on chip SoC of this type belongs to the Zynq? UltraScale+? MPSoC EG series.Temperatures should be 0°C~100°C TJ on average for this SoC meaning.This SoC security combines Zynq?UltraScale+? FPGA, 926K+ Logic Cells, an important feature to keep in mind.It is packaged in a state-of-the-art Tray package.644 I/Os in total are included in this SoC part.