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XCZU11EG-2FFVC1760I

-40°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC EG Series 512 I/O

Manufacturer: Xilinx Inc.
Origchip NO: 903-XCZU11EG-2FFVC1760I
Package: 1760-BBGA, FCBGA
Datasheet: PDF
Stock: 750
Description: -40°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC EG Series 512 I/O(Kg)

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Parameters
Number of I/O	512
Speed	533MHz, 600MHz, 1.3GHz
RAM Size	256KB
Core Processor	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Peripherals	DMA, WDT
Connectivity	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture	MCU, FPGA
Primary Attributes	Zynq®UltraScale+™ FPGA, 653K+ Logic Cells
RoHS Status	ROHS3 Compliant
Factory Lead Time	11 Weeks
Package / Case	1760-BBGA, FCBGA
Operating Temperature	-40°C~100°C TJ
Packaging	Tray
Published	2016
Series	Zynq® UltraScale+™ MPSoC EG
Part Status	Active
Moisture Sensitivity Level (MSL)	4 (72 Hours)
HTS Code	8542.31.00.01
Peak Reflow Temperature (Cel)	NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s)	NOT SPECIFIED

This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s).

Based on the core processor(s) Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2, this SoC has been developed.There is a 1760-BBGA, FCBGA package assigned to this system on a chip by the manufacturer.A SoC chip with 256KB RAM is provided for users to enjoy reliable performance.In terms of internal architecture, this SoC design uses the MCU, FPGA method.It is part of the Zynq? UltraScale+? MPSoC EG series of system on a chips.Typical operating temperatures for this SoC meaning should be -40°C~100°C TJ.It is important to note that this SoC security combines Zynq?UltraScale+? FPGA, 653K+ Logic Cells.It comes in a state-of-the-art Tray package.This SoC part has a total of 512 I/Os.