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XC7Z100-1FF900I

-40°C~100°C TJ System On ChipZynq?-7000 Series 130 I/O

Manufacturer: Xilinx Inc.
Origchip NO: 903-XC7Z100-1FF900I
Package: 900-BBGA, FCBGA
Datasheet: PDF
Stock: 131
Description: -40°C~100°C TJ System On ChipZynq?-7000 Series 130 I/O(Kg)

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Details

Tags

Parameters
Factory Lead Time	10 Weeks
Package / Case	900-BBGA, FCBGA
Supplier Device Package	900-FCBGA (31x31)
Operating Temperature	-40°C~100°C TJ
Packaging	Tray
Published	2010
Series	Zynq®-7000
Part Status	Active
Moisture Sensitivity Level (MSL)	4 (72 Hours)
Max Operating Temperature	100°C
Min Operating Temperature	-40°C
Frequency	667MHz
Interface	CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
Number of I/O	130
Speed	667MHz
RAM Size	256KB
Core Processor	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Peripherals	DMA
Connectivity	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture	MCU, FPGA
Data Bus Width	32b
Core Architecture	ARM
Max Frequency	667MHz
Primary Attributes	Kintex™-7 FPGA, 444K Logic Cells
RoHS Status	Non-RoHS Compliant

This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).

On this SoC, there is Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor.Package 900-BBGA, FCBGA is assigned to this system on a chip by the manufacturer.With 256KB RAM implemented, this SoC chip provides reliable operation.Internally, this SoC design uses the MCU, FPGA technique.The Zynq?-7000 series contains this system on chip SoC.It is expected that this SoC meaning will operate at -40°C~100°C TJ on average.A significant feature of this SoC security is the combination of Kintex?-7 FPGA, 444K Logic Cells.Housed in the state-of-art Tray package.This SoC part has a total of 130 I/Os.During operation, the wireless SoC runs at a frequency of 667MHz.In terms of core architecture, the SoC meaning relies on ARM.The SoC computing will start only if -40°C is set.This SoC system on chip operates at a maximum design temperature of 100°C.