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900 Terminations-40°C~100°C TJ System On ChipZynq?-7000 Series 130 I/O1V

  • Manufacturer: Xilinx Inc.
  • Origchip NO: 903-XC7Z045-L2FFG900I
  • Package: 900-BBGA, FCBGA
  • Datasheet: PDF
  • Stock: 445
  • Description: 900 Terminations-40°C~100°C TJ System On ChipZynq?-7000 Series 130 I/O1V (Kg)

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Factory Lead Time 10 Weeks
Package / Case 900-BBGA, FCBGA
Surface Mount YES
Operating Temperature -40°C~100°C TJ
Packaging Tray
Published 2010
Series Zynq®-7000
JESD-609 Code e1
Part Status Active
Moisture Sensitivity Level (MSL) 4 (72 Hours)
Number of Terminations 900
ECCN Code 3A991.D
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Additional Feature PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY
HTS Code 8542.39.00.01
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 245
Supply Voltage 1V
Terminal Pitch 1mm
Frequency 800MHz
Time@Peak Reflow Temperature-Max (s) 30
JESD-30 Code S-PBGA-B900
Supply Voltage-Max (Vsup) 1.05V
Supply Voltage-Min (Vsup) 0.95V
Interface CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
Number of I/O 130
RAM Size 256KB
Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Peripherals DMA
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Core Architecture ARM
Boundary Scan YES
RAM (words) 256000
Primary Attributes Kintex™-7 FPGA, 350K Logic Cells
Bus Compatibility CAN; ETHERNET; I2C; SPI; UART; USB
Height Seated (Max) 3.35mm
Length 31mm
Width 31mm
RoHS Status ROHS3 Compliant

This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).

Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s) are used in the construction of this SoC.This system on a chip is packaged as 900-BBGA, FCBGA by the manufacturer.This SoC chip is equipped with 256KB RAM and guarantees reliable performance to the user.Using the MCU, FPGA technique, this SoC design's internal architecture is simple.Featured system on chip SoCs of the Zynq?-7000 series.This SoC meaning should have an average operating temperature of -40°C~100°C TJ when it is operating normally.A key point to note is that this SoC security combines Kintex?-7 FPGA, 350K Logic Cells.This SoC system on a chip has been designed in a state-of-the-art Tray package.An integral part of this SoC consists of a total of 130 I/Os.A 1V power supply is recommended.In the SoCs wireless, voltages above 1.05V are considered unsafe.As long as it receives a power supply that is at least 0.95V, it should be able to function.In total, there are 900 terminations, so system on a chip is really aided by this.It operates at a frequency of 800MHz.There are a number of features to this SoC meaning which are based on the core architecture of ARM.Moreover, this SoC processor comes with PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY.

Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.

256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM

There are a lot of Xilinx Inc.

XC7Z045-L2FFG900I System On Chip (SoC) applications.

  • Vending machines
  • Functional safety for critical applications in the aerospace
  • Keyboard
  • Print Special Issue Flyer
  • Automotive gateway
  • USB hard disk enclosure
  • Industrial robot
  • Cyber security for critical applications in the aerospace
  • CNC control
  • POS Terminals
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