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XC7Z045-1FFG676C

676 Terminations0°C~85°C TJ XC7Z045 System On ChipZynq?-7000 Series 130 I/O1V


  • Manufacturer: Xilinx Inc.
  • Origchip NO: 903-XC7Z045-1FFG676C
  • Package: 676-BBGA, FCBGA
  • Datasheet: PDF
  • Stock: 455
  • Description: 676 Terminations0°C~85°C TJ XC7Z045 System On ChipZynq?-7000 Series 130 I/O1V (Kg)

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Details

Tags

Parameters
Factory Lead Time 10 Weeks
Contact Plating Copper, Silver, Tin
Package / Case 676-BBGA, FCBGA
Surface Mount YES
Operating Temperature 0°C~85°C TJ
Packaging Tray
Published 2009
Series Zynq®-7000
JESD-609 Code e1
Part Status Active
Moisture Sensitivity Level (MSL) 4 (72 Hours)
Number of Terminations 676
ECCN Code 3A991.D
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
HTS Code 8542.39.00.01
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 245
Supply Voltage 1V
Terminal Pitch 1mm
Frequency 667MHz
Time@Peak Reflow Temperature-Max (s) 30
Base Part Number XC7Z045
JESD-30 Code S-PBGA-B676
Operating Supply Voltage 1V
Supply Voltage-Max (Vsup) 1.05V
Interface CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
Number of I/O 130
RAM Size 256KB
Memory Type ROMless
Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Peripherals DMA
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Data Bus Width 32b
Core Architecture ARM
Boundary Scan YES
Speed Grade -1
RAM (words) 256000
Primary Attributes Kintex™-7 FPGA, 350K Logic Cells
Bus Compatibility CAN; ETHERNET; I2C; SPI; UART; USB
Height Seated (Max) 3.37mm
Length 27mm
Radiation Hardening No
RoHS Status ROHS3 Compliant

This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).


A core processor(s) Dual ARM? Cortex?-A9 MPCore? with CoreSight? is integrated into this SoC.Package 676-BBGA, FCBGA is assigned to this system on a chip by the manufacturer.With 256KB RAM implemented, this SoC chip provides users with a high level of performance.A MCU, FPGA technique is used for the SoC design's internal architecture.It is a member of the Zynq?-7000 series.In general, this SoC meaning should operate at a temperature of 0°C~85°C TJ on a regular basis.It is important to note that this SoC security combines Kintex?-7 FPGA, 350K Logic Cells.It is packaged in a state-of-the-art Tray package.This SoC part has a total of 130 I/Os.It is recommended to use a 1V power supply.The SoCs wireless cannot operate at a voltage greater than 1.05V because it is considered unsafe for the application.Having 676 terminations in total makes system on a chip possible.You can get system on chips with similar specs and purposes by searching XC7Z045.In this wireless SoC, the frequency is set to 667MHz.In order to operate the SoC meaning, it must be based on the core architecture of ARM.

Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.


256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM

There are a lot of Xilinx Inc.


XC7Z045-1FFG676C System On Chip (SoC) applications.

  • Communication network-on-Chip (cNoC)
  • Healthcare
  • String inverter
  • Smart appliances
  • Optical drive
  • ARM Cortex M4 microcontroller
  • Special Issue Editors
  • Central inverter
  • Sports
  • Networked Media Encode/Decode
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