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XC7Z035-2FFV676E

0°C~100°C TJ System On ChipZynq?-7000 Series 130 I/O

Manufacturer: Xilinx Inc.
Origchip NO: 903-XC7Z035-2FFV676E
Package: 676-BBGA, FCBGA
Datasheet: PDF
Stock: 806
Description: 0°C~100°C TJ System On ChipZynq?-7000 Series 130 I/O(Kg)

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Details

Tags

Parameters
Factory Lead Time	11 Weeks
Package / Case	676-BBGA, FCBGA
Supplier Device Package	676-FCBGA (27x27)
Operating Temperature	0°C~100°C TJ
Packaging	Bulk
Published	2010
Series	Zynq®-7000
Part Status	Active
Moisture Sensitivity Level (MSL)	4 (72 Hours)
Number of I/O	130
Speed	800MHz
RAM Size	256KB
Core Processor	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Peripherals	DMA
Connectivity	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture	MCU, FPGA
Primary Attributes	Kintex™-7 FPGA, 275K Logic Cells
RoHS Status	ROHS3 Compliant

This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).

This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).It has been assigned a package 676-BBGA, FCBGA by its manufacturer for this system on a chip.With 256KB RAM implemented, this SoC chip provides users with a high level of performance.As far as its internal architecture is concerned, this SoC design employs the MCU, FPGA technique.A system on chip SoC of this type belongs to the Zynq?-7000 series.This SoC meaning should have an average operating temperature of 0°C~100°C TJ.There is one thing to note about this SoC security: it combines Kintex?-7 FPGA, 275K Logic Cells.Featured in the state-of-the-art Bulk package, this SoC system on a chip provides outstanding performance.This SoC part contains a total of 130 I/Os in total.