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XC7Z030-2SBG485I

485 Terminations-40°C~100°C TJ 485 Pin System On ChipZynq?-7000 Series 130 I/O1V


  • Manufacturer: Xilinx Inc.
  • Origchip NO: 903-XC7Z030-2SBG485I
  • Package: 484-FBGA, FCBGA
  • Datasheet: PDF
  • Stock: 182
  • Description: 485 Terminations-40°C~100°C TJ 485 Pin System On ChipZynq?-7000 Series 130 I/O1V (Kg)

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Details

Tags

Parameters
Factory Lead Time 10 Weeks
Contact Plating Copper, Silver, Tin
Mount Surface Mount
Package / Case 484-FBGA, FCBGA
Number of Pins 485
Operating Temperature -40°C~100°C TJ
Packaging Tray
Published 2009
Series Zynq®-7000
JESD-609 Code e1
Part Status Active
Moisture Sensitivity Level (MSL) 4 (72 Hours)
Number of Terminations 485
ECCN Code EAR99
Terminal Finish Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
Additional Feature PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY
HTS Code 8542.39.00.01
Subcategory Other Microprocessor ICs
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 1V
Terminal Pitch 0.8mm
Frequency 800MHz
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 1.05V
Power Supplies 11.8V
Supply Voltage-Min (Vsup) 0.95V
Interface CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
Number of I/O 130
RAM Size 256KB
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT
Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Peripherals DMA
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Data Bus Width 32b
Core Architecture ARM
Boundary Scan YES
RAM (words) 256000
Primary Attributes Kintex™-7 FPGA, 125K Logic Cells
Bus Compatibility CAN; ETHERNET; I2C; SPI; UART; USB
UV Erasable N
Height Seated (Max) 2.44mm
Length 19mm
RoHS Status ROHS3 Compliant

This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).


Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s) are used in the construction of this SoC.It has been assigned a package 484-FBGA, FCBGA by its manufacturer for this system on a chip.With 256KB RAM implemented, this SoC chip provides users with reliable performance.In terms of internal architecture, this SoC design uses the MCU, FPGA method.Zynq?-7000 is the series number of this system on chip SoC.For this SoC meaning, the average operating temperature should be -40°C~100°C TJ.Taking note of the fact that this SoC security combines Kintex?-7 FPGA, 125K Logic Cells is important.Tray package houses this SoC system on a chip.In total, this SoC part has 130 I/Os.It is advised to utilize a 1V power supply.There are voltages higher than 1.05V that should be avoided when using the SoCs wireless.At least 0.95V can be supplied as a power source.There are 485 terminations in total and that really benefits system on a chip.This system on a chip is just as capable as any other high-quality Other Microprocessor ICs.There is 11.8V power supply requirement for this system on chip SoC.As its uPs/uCs/Peripheral SoC, it uses MICROPROCESSOR CIRCUIT.There is 800MHz frequency associated with the wireless SoC.This SoC meaning utilizes a core architecture of ARM as its foundation.Aside from that, this SoC processor is also equipped with some additional features that are present in PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY.In this computer SoC, there are 485 pins.

Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.


256KB RAM.
Built on MCU, FPGA.
MICROPROCESSOR CIRCUIT
Core Architecture: ARM
PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY

There are a lot of Xilinx Inc.


XC7Z030-2SBG485I System On Chip (SoC) applications.

  • ARM Cortex M4 microcontroller
  • Functional safety for critical applications in the industrial sectors
  • Sensor network-on-chip (sNoC)
  • Keywords
  • Personal Computers
  • Industrial automation devices
  • Video Imaging
  • Functional safety for critical applications in the aerospace
  • Communication interfaces ( I2C, SPI )
  • Cyber security for critical applications in the aerospace
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