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XC7Z030-2FFG676I

676 Terminations-40°C~100°C TJ 676 Pin XC7Z030 System On ChipZynq?-7000 Series 130 I/O1V


  • Manufacturer: Xilinx Inc.
  • Origchip NO: 903-XC7Z030-2FFG676I
  • Package: 676-BBGA, FCBGA
  • Datasheet: PDF
  • Stock: 611
  • Description: 676 Terminations-40°C~100°C TJ 676 Pin XC7Z030 System On ChipZynq?-7000 Series 130 I/O1V (Kg)

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Details

Tags

Parameters
Factory Lead Time 10 Weeks
Contact Plating Copper, Silver, Tin
Package / Case 676-BBGA, FCBGA
Surface Mount YES
Number of Pins 676
Operating Temperature -40°C~100°C TJ
Packaging Tray
Published 2009
Series Zynq®-7000
JESD-609 Code e1
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 4 (72 Hours)
Number of Terminations 676
ECCN Code 3A991.D
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
HTS Code 8542.39.00.01
Subcategory Other uPs/uCs/Peripheral ICs
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 245
Supply Voltage 1V
Terminal Pitch 1mm
Frequency 800MHz
Time@Peak Reflow Temperature-Max (s) 30
Base Part Number XC7Z030
Pin Count 676
Operating Supply Voltage 1V
Supply Voltage-Max (Vsup) 1.05V
Power Supplies 11.8V
Interface CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
Number of I/O 130
RAM Size 256KB
Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Peripherals DMA
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Data Bus Width 32b
Core Architecture ARM
Boundary Scan YES
Speed Grade -2
RAM (words) 256000
Primary Attributes Kintex™-7 FPGA, 125K Logic Cells
Bus Compatibility CAN; ETHERNET; I2C; SPI; UART; USB
UV Erasable N
Height Seated (Max) 3.24mm
Length 27mm
Radiation Hardening No
RoHS Status ROHS3 Compliant

This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).


Based on the core processor(s) Dual ARM? Cortex?-A9 MPCore? with CoreSight?, this SoC is built.There is a 676-BBGA, FCBGA package assigned to this system on a chip by the manufacturer.The 256KB RAM implementation of this SoC chip ensures efficient performance for users.Internally, this SoC design uses the MCU, FPGA technique.It is a member of the Zynq?-7000 series.This SoC meaning should have an average operating temperature of -40°C~100°C TJ when it is operating normally.A key point to note is that this SoC security combines Kintex?-7 FPGA, 125K Logic Cells.Housed in the state-of-art Tray package.Total I/Os on this SoC part are 130.A 1V power supply should be used.The SoCs wireless is considered unreliable if the voltage exceeds 1.05V.There are 676 terminations in total and that really benefits system on a chip.In addition, it boasts impressive system on a chipming capabilities, just like other high-quality Other uPs/uCs/Peripheral ICs.In order to operate system on chip, you will need 11.8V power supplies.Searching XC7Z030 will bring up system on chips with similar specs and purposes.The wireless SoC works at a frequency of 800MHz.In this SoC meaning, ARM serves as the core architecture.This is the 676-pin version of the computer SoC.

Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.


256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM

There are a lot of Xilinx Inc.


XC7Z030-2FFG676I System On Chip (SoC) applications.

  • RISC-V
  • Central alarm system
  • Keyboard
  • POS Terminals
  • Efficient hardware for inference of neural networks
  • Transmitters
  • Healthcare
  • Mobile market
  • POS Terminals
  • Published Paper
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