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XC7Z030-2FBG676E

676 Terminations0°C~100°C TJ 676 Pin XC7Z030 System On ChipZynq?-7000 Series 130 I/O1V


  • Manufacturer: Xilinx Inc.
  • Origchip NO: 903-XC7Z030-2FBG676E
  • Package: 676-BBGA, FCBGA
  • Datasheet: PDF
  • Stock: 739
  • Description: 676 Terminations0°C~100°C TJ 676 Pin XC7Z030 System On ChipZynq?-7000 Series 130 I/O1V (Kg)

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Details

Tags

Parameters
Factory Lead Time 10 Weeks
Contact Plating Copper, Silver, Tin
Package / Case 676-BBGA, FCBGA
Surface Mount YES
Number of Pins 676
Operating Temperature 0°C~100°C TJ
Packaging Tray
Published 2009
Series Zynq®-7000
JESD-609 Code e1
Part Status Active
Moisture Sensitivity Level (MSL) 4 (72 Hours)
Number of Terminations 676
ECCN Code 3A991.D
Terminal Finish Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
HTS Code 8542.39.00.01
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 245
Supply Voltage 1V
Terminal Pitch 1mm
Frequency 800MHz
Time@Peak Reflow Temperature-Max (s) 30
Base Part Number XC7Z030
Operating Supply Voltage 1V
Supply Voltage-Max (Vsup) 1.05V
Interface CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
Number of I/O 130
RAM Size 256KB
Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Peripherals DMA
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Data Bus Width 32b
Core Architecture ARM
Boundary Scan YES
Speed Grade -2
RAM (words) 256000
Primary Attributes Kintex™-7 FPGA, 125K Logic Cells
Bus Compatibility CAN; ETHERNET; I2C; SPI; UART; USB
Height Seated (Max) 2.54mm
Length 27mm
Radiation Hardening No
RoHS Status ROHS3 Compliant

This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).


A core processor Dual ARM? Cortex?-A9 MPCore? with CoreSight? is embedded in this SoC.Assigned with the package 676-BBGA, FCBGA, this system on a chip comes from the manufacturer.A 256KB RAM SoC chip provides reliable performance to users.Using the MCU, FPGA technique, this SoC design's internal architecture is simple.The Zynq?-7000 series contains this system on chip SoC.This SoC meaning should have an average operating temperature of 0°C~100°C TJ.A significant feature of this SoC security is the combination of Kintex?-7 FPGA, 125K Logic Cells.There is a state-of-the-art Tray package that houses this SoC system on a chip.As a whole, this SoC part includes 130 I/Os.Use a power supply with a voltage of 1V if possible.The SoCs wireless cannot operate at a voltage greater than 1.05V because it is considered unsafe for the application.In total, there are 676 terminations, so system on a chip is really aided by this.Searching XC7Z030 will yield system on chips with similar specs and purposes.During operation, the wireless SoC runs at a frequency of 800MHz.There is no doubt that the SoC meaning is based on the core architecture of ARM.The computer SoC has a pin count of 676.

Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.


256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM

There are a lot of Xilinx Inc.


XC7Z030-2FBG676E System On Chip (SoC) applications.

  • Communication interfaces ( I2C, SPI )
  • Apple smart watch
  • Sensor network-on-chip (sNoC)
  • Vending machines
  • Industrial automation devices
  • Networked Media Encode/Decode
  • Central alarm system
  • Industrial transport
  • Measurement testers
  • Microprocessors
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