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XC7Z030-1FFG676C

676 Terminations0°C~85°C TJ 676 Pin XC7Z030 System On ChipZynq?-7000 Series 130 I/O1V


  • Manufacturer: Xilinx Inc.
  • Origchip NO: 903-XC7Z030-1FFG676C
  • Package: 676-BBGA, FCBGA
  • Datasheet: PDF
  • Stock: 822
  • Description: 676 Terminations0°C~85°C TJ 676 Pin XC7Z030 System On ChipZynq?-7000 Series 130 I/O1V (Kg)

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Details

Tags

Parameters
Factory Lead Time 10 Weeks
Contact Plating Copper, Silver, Tin
Package / Case 676-BBGA, FCBGA
Surface Mount YES
Number of Pins 676
Operating Temperature 0°C~85°C TJ
Packaging Tray
Published 2009
Series Zynq®-7000
JESD-609 Code e1
Part Status Active
Moisture Sensitivity Level (MSL) 4 (72 Hours)
Number of Terminations 676
ECCN Code 3A991.D
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
HTS Code 8542.39.00.01
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 245
Supply Voltage 1V
Terminal Pitch 1mm
Frequency 667MHz
Time@Peak Reflow Temperature-Max (s) 30
Base Part Number XC7Z030
Operating Supply Voltage 1V
Supply Voltage-Max (Vsup) 1.05V
Interface CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
Number of I/O 130
RAM Size 256KB
Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Peripherals DMA
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Data Bus Width 32b
Core Architecture ARM
Boundary Scan YES
Speed Grade -1
RAM (words) 256000
Primary Attributes Kintex™-7 FPGA, 125K Logic Cells
Bus Compatibility CAN; ETHERNET; I2C; SPI; UART; USB
Height Seated (Max) 3.24mm
Length 27mm
Radiation Hardening No
RoHS Status ROHS3 Compliant

This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).


On this SoC, there is Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor.There is a 676-BBGA, FCBGA package assigned to this system on a chip by the manufacturer.This SoC chip is equipped with 256KB RAM and guarantees reliable performance to the user.Using the MCU, FPGA technique, this SoC design's internal architecture is simple.It is a member of the Zynq?-7000 series.This SoC meaning should have an average operating temperature of 0°C~85°C TJ.As one of the most important things to note is that this SoC security combines Kintex?-7 FPGA, 125K Logic Cells together.It comes in a state-of-the-art Tray package.This SoC part contains a total of 130 I/Os in total.Ideally, a power supply with a voltage of 1V should be used.In the SoCs wireless, voltages above 1.05V are considered unsafe.The system on a chip uses 676 terminations in total.A search for XC7Z030 will result in system on chips that have similar specs and purposes.A wireless SoC that operates at a frequency of 667MHz is what the wireless SoC does.Based on the core architecture of ARM, the SoC meaning has a high level of performance.The computer SoC has a pin count of 676.

Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.


256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM

There are a lot of Xilinx Inc.


XC7Z030-1FFG676C System On Chip (SoC) applications.

  • Mobile computing
  • POS Terminals
  • Industrial AC-DC
  • Self-aware system-on-chip (SoC)
  • Temperature
  • CNC control
  • Special Issue Information
  • Print Special Issue Flyer
  • Industrial robot
  • Smart appliances
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