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XC7Z015-2CL485I

-40°C~100°C TJ System On ChipZynq?-7000 Series 130 I/O

Manufacturer: Xilinx Inc.
Origchip NO: 903-XC7Z015-2CL485I
Package: 484-LFBGA, CSPBGA
Datasheet: -
Stock: 163
Description: -40°C~100°C TJ System On ChipZynq?-7000 Series 130 I/O(Kg)

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Details

Tags

Parameters
Factory Lead Time	10 Weeks
Package / Case	484-LFBGA, CSPBGA
Supplier Device Package	484-CSPBGA (19x19)
Operating Temperature	-40°C~100°C TJ
Packaging	Bulk
Published	2010
Series	Zynq®-7000
Part Status	Active
Moisture Sensitivity Level (MSL)	2A (4 Weeks)
Number of I/O	130
Speed	766MHz
RAM Size	256KB
Core Processor	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Peripherals	DMA
Connectivity	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture	MCU, FPGA
Primary Attributes	Artix™-7 FPGA, 74K Logic Cells
RoHS Status	Non-RoHS Compliant

This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).

Based on the core processor(s) Dual ARM? Cortex?-A9 MPCore? with CoreSight?, this SoC has been developed.It has been assigned a package 484-LFBGA, CSPBGA by its manufacturer for this system on a chip.With 256KB RAM implemented, this SoC chip provides reliable operation.When it comes to internal architecture, this SoC design employs the MCU, FPGA technique.Zynq?-7000 is the series number of this system on chip SoC.This SoC meaning should have an average operating temperature of -40°C~100°C TJ when it is operating normally.This SoC security combines Artix?-7 FPGA, 74K Logic Cells, an important feature to keep in mind.Featured in the state-of-the-art Bulk package, this SoC system on a chip provides outstanding performance.An integral part of this SoC consists of a total of 130 I/Os.