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XC7Z010-L1CLG225I

225 Terminations-40°C~100°C TJ System On ChipZynq?-7000 Series 86 I/O1V


  • Manufacturer: Xilinx Inc.
  • Origchip NO: 903-XC7Z010-L1CLG225I
  • Package: 225-LFBGA, CSPBGA
  • Datasheet: PDF
  • Stock: 790
  • Description: 225 Terminations-40°C~100°C TJ System On ChipZynq?-7000 Series 86 I/O1V (Kg)

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Details

Tags

Parameters
Factory Lead Time 10 Weeks
Contact Plating Copper, Silver, Tin
Mount Surface Mount
Package / Case 225-LFBGA, CSPBGA
Operating Temperature -40°C~100°C TJ
Packaging Tray
Published 2010
Series Zynq®-7000
JESD-609 Code e1
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 225
ECCN Code EAR99
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Additional Feature PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY
HTS Code 8542.39.00.01
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 260
Supply Voltage 1V
Terminal Pitch 0.8mm
Frequency 667MHz
Time@Peak Reflow Temperature-Max (s) 30
JESD-30 Code S-PBGA-B225
Operating Supply Voltage 1V
Supply Voltage-Max (Vsup) 1.05V
Interface CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
Number of I/O 86
RAM Size 256KB
Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Peripherals DMA
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Data Bus Width 32b
Core Architecture ARM
Boundary Scan YES
RAM (words) 256000
Primary Attributes Artix™-7 FPGA, 28K Logic Cells
Bus Compatibility CAN; ETHERNET; I2C; SPI; UART; USB
Height Seated (Max) 1.5mm
Length 13mm
RoHS Status ROHS3 Compliant

This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).


A core processor(s) Dual ARM? Cortex?-A9 MPCore? with CoreSight? is integrated into this SoC.Manufacturer assigns package 225-LFBGA, CSPBGA to this system on a chip.A SoC chip with 256KB RAM is provided for users to enjoy reliable performance.As far as its internal architecture is concerned, this SoC design employs the MCU, FPGA technique.Featured system on chip SoCs of the Zynq?-7000 series.This SoC meaning should have an average operating temperature of -40°C~100°C TJ when it is operating normally.This SoC security combines Artix?-7 FPGA, 28K Logic Cells and that is something to note.In the state-of-the-art Tray package, this SoC system on a chip is housed.Total I/Os on this SoC part are 86.As a rule of thumb, it is advised to use a power supply with a value of 1V.In the SoCs wireless, high voltages above 1.05V are considered dangerous and should not be used.Having 225 terminations in total makes system on a chip possible.During operation, the wireless SoC runs at a frequency of 667MHz.It uses ARM as its core architecture.Additionally, this SoC processor features PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY.

Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.


256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM
PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY

There are a lot of Xilinx Inc.


XC7Z010-L1CLG225I System On Chip (SoC) applications.

  • Cyber security for critical applications in the aerospace
  • Microcontroller
  • Optical drive
  • Digital Media
  • Networked Media Encode/Decode
  • Temperature Sensors
  • Special Issue Information
  • High-end PLC
  • Networked sensors
  • Measurement tools
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