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XC17256ELPD8C

Through Hole 256Kb Mb Tube Configuration Proms for FPGAs Not Applicable OTP Obsolete XC17256EL


  • Manufacturer: Xilinx Inc.
  • Origchip NO: 903-XC17256ELPD8C
  • Package: 8-DIP (0.300, 7.62mm)
  • Datasheet: PDF
  • Stock: 964
  • Description: Through Hole 256Kb Mb Tube Configuration Proms for FPGAs Not Applicable OTP Obsolete XC17256EL (Kg)

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Details

Tags

Parameters
Mounting Type Through Hole
Package / Case 8-DIP (0.300, 7.62mm)
Surface Mount NO
Number of Pins 8
Operating Temperature 0°C~70°C
Packaging Tube
Published 2000
JESD-609 Code e0
Part Status Obsolete
Moisture Sensitivity Level (MSL) Not Applicable
Number of Terminations 8
ECCN Code EAR99
Additional Feature USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS
Technology CMOS
Voltage - Supply 3V~3.6V
Terminal Position DUAL
Peak Reflow Temperature (Cel) 225
Number of Functions 1
Supply Voltage 3.3V
Terminal Pitch 2.54mm
Time@Peak Reflow Temperature-Max (s) 30
Base Part Number XC17256EL
Pin Count 8
Operating Supply Voltage 3.3V
Supply Voltage-Max (Vsup) 3.6V
Supply Voltage-Min (Vsup) 3V
Programmable Type OTP
Memory Size 256Kb
Clock Frequency 15MHz
Supply Current-Max 0.005mA
Organization 256KX1
Output Characteristics 3-STATE
Memory Width 1
Density 256 kb
Standby Current-Max 0.00005A
Parallel/Serial SERIAL
I/O Type COMMON
Memory IC Type CONFIGURATION MEMORY
Height Seated (Max) 4.5974mm
Length 9.3599mm
Width 7.62mm
Radiation Hardening No
RoHS Status Non-RoHS Compliant
Lead Free Contains Lead

XC17256ELPD8C Overview


There is a neat 8-DIP (0.300, 7.62mm) package that is used in this program.Packaging for Tube.Qualified to perform a variety of tasks within the 0°C~70°C environment.OTP allows for programmability.There is a voltage of 3V~3.6V applied to the device.Through Hole is the orientation of this memory device.There is a limit to the size of data storage of 256Kb bytes.Other related parts can be found by searching "XC17256EL".Supply voltage 3.3V is required.Different types of 8 terminations are available with different functions.A maximum voltage of 3.6V can be applied to this memory device.It is necessary to supply the device with a minimum voltage of 3V.A CONFIGURATION MEMORY memory chip is shown here.When soldering in reflow mode, the temperature should be kept below 225 at all times during the soldering process.FPGA is equipped wFPGAh 8 pins.In this memory, data is transmitted using the SERIAL process.In order for a memory chip to function properly, it must be subjected to a voltage of not more than 0.005mA.Parts come with 8 pins set.Using a 15MHz frequency, this memory IC can work at high speeds.There is a COMMON configuration for the memory's I/O.3.3V recommends that users apply 3.3V to the part before using it in a circuit so it can run safely and reliably.For better customer service, USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS is added.

XC17256ELPD8C Features


Operating temperature: 0°C~70°C.
OTP program capability.
CONFIGURATION MEMORY memory IC.
SERIAL processing.
COMMON I/O equipped.

XC17256ELPD8C Applications


There are a lot of Xilinx Inc. XC17256ELPD8C applications of configuration proms for FPGAs.

  • nonvolatile BIOS memory
  • multimedia computers
  • servers
  • eSRAM
  • networks
  • workstations,
  • networking
  • graphics card
  • main computer memory
  • embedded logic
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