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VSC8662XIC-03

256 TerminationsTelecom device1 Circuits


  • Manufacturer: Microchip Technology
  • Origchip NO: 536-VSC8662XIC-03
  • Package: 256-BGA
  • Datasheet: PDF
  • Stock: 920
  • Description: 256 TerminationsTelecom device1 Circuits(Kg)

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FedEx International, 5-7 business days.

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Details

Tags

Parameters
Factory Lead Time 9 Weeks
Lifecycle Status IN PRODUCTION (Last Updated: 1 month ago)
Mounting Type Surface Mount
Package / Case 256-BGA
Surface Mount YES
Packaging Tray
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 256
Max Operating Temperature 100°C
Min Operating Temperature -40°C
Terminal Position BOTTOM
Terminal Form BALL
Supply Voltage 1.2V
JESD-30 Code S-PBGA-B256
Function Ethernet
Temperature Grade INDUSTRIAL
Number of Circuits 1
Data Rate 1.25 Gbps
Number of Transceivers 2
Height Seated (Max) 2mm
RoHS Status ROHS3 Compliant

VSC8662XIC-03 Overview


A 256-BGA package is used to reduce board space requirements.A Tray-packing method is used to pack telecommunications equipment.Mounting type Surface Mount is used.The telecom IC is composed of 1 circuits.Telecom switching configuration has 256 terminations.It operates at a voltage of 1.2V.A minimum temperature value -40°C is set to ensure normal operation.A maximum value of 100°C is set to ensure normal operation.Transceivers 2 are integrated into telecommunication tools.

VSC8662XIC-03 Features


Available in the 256-BGA package
2 transceivers

VSC8662XIC-03 Applications


There are a lot of Microchip Technology VSC8662XIC-03 Telecom applications.

  • Remote wireless modules
  • Frame Relay Switches and Access Devices (FRADS)
  • Integrated Access Devices (IADs)
  • E1 Rates PCM Line Interface
  • NIU
  • Integrated Multi-Service Access Platforms (IMAPs)
  • CSU/DSU Equipment
  • Fractional T1/E1/J1
  • Digital cross connects (DSX-1)
  • Switching Systems
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