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OSD3358-512M-BAS

OSD3358-512M-BAS datasheet pdf and Embedded - Microcontroller, Microprocessor, FPGA Modules product details from Octavo Systems LLC stock available at XINJIADA

Manufacturer: Octavo Systems LLC
Origchip NO: 561-OSD3358-512M-BAS
Package: SIP
Datasheet: PDF
Stock: 825
Description: OSD3358-512M-BAS datasheet pdf and Embedded - Microcontroller, Microprocessor, FPGA Modules product details from Octavo Systems LLC stock available at XINJIADA(Kg)

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Details

Tags

Parameters
Factory Lead Time	10 Weeks
Package / Case	SIP
Operating Temperature	0°C~85°C
Published	2016
Series	OSD335x
Size / Dimension	1.06 x 1.06 27.0mmx27.0mm
Part Status	Active
Moisture Sensitivity Level (MSL)	4 (72 Hours)
Connector Type	400-BGA
Max Operating Temperature	85°C
Min Operating Temperature	0°C
Speed	1GHz
RAM Size	512MB
Core Processor	ARM® Cortex®-A8, AM3358
Module/Board Type	MPU Core
Co-Processor	NEON™ SIMD
RoHS Status	ROHS3 Compliant

OSD3358-512M-BAS Overview

A MPU Core-type board or module is used in this microcontroller.Microprocessor chip is powered by a processor with a total of ARM? Cortex?-A8, AM3358 cores in it.The default setting of the microcontroller is 0°C~85°C.400-BGA' stands for connector type.I would say that MCU chip belongs to the OSD335x Series.As a result, the RAM size of the software has been reduced to 512MB in order to ensure that MCU chip runs normally.During operation, the MCU chip moves at 1GHz speed.In addmicroprocessorion to that, microprocessor is packaged wmicroprocessorh SIP.The maximum operational temperature at this time is 85°C.Microprocessor should be warmer than 0°C when microprocessor is operating.An Intel NEON? SIMD Core Processor is at the heart of this MCUs.