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M2S010TS-VFG256I

256 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 138 I/O1.2V


  • Manufacturer: Microsemi Corporation
  • Origchip NO: 523-M2S010TS-VFG256I
  • Package: 256-LBGA
  • Datasheet: PDF
  • Stock: 110
  • Description: 256 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 138 I/O1.2V (Kg)

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Details

Tags

Parameters
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 1.2V
Terminal Pitch 0.8mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code S-PBGA-B256
Number of Outputs 138
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 1.26V
Power Supplies 1.2V
Supply Voltage-Min (Vsup) 1.14V
Number of I/O 138
Speed 166MHz
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DDR, PCIe, SERDES
Connectivity CANbus, Ethernet, I2C, SPI, UART/USART, USB
Architecture MCU, FPGA
Number of Inputs 138
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Primary Attributes FPGA - 10K Logic Modules
Number of Logic Cells 12084
Flash Size 256KB
Height Seated (Max) 1.56mm
Length 14mm
Width 14mm
RoHS Status RoHS Compliant
Factory Lead Time 10 Weeks
Package / Case 256-LBGA
Surface Mount YES
Operating Temperature -40°C~100°C TJ
Packaging Tray
Series SmartFusion®2
JESD-609 Code e3
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 256
Terminal Finish MATTE TIN
Additional Feature LG-MIN, WD-MIN
HTS Code 8542.39.00.01
Subcategory Field Programmable Gate Arrays

This SoC is built on ARM? Cortex?-M3 core processor(s).


There are ARM? Cortex?-M3 core processors in this SoC.Assigned with the package 256-LBGA, this system on a chip comes from the manufacturer.With 64KB RAM implemented, this SoC chip provides reliable operation.When it comes to internal architecture, this SoC design employs the MCU, FPGA technique.It is a member of the SmartFusion?2 series.This SoC meaning should have an average operating temperature of -40°C~100°C TJ when it is operating normally.Taking note of the fact that this SoC security combines FPGA - 10K Logic Modules is important.Tray package houses this SoC system on a chip.138 I/Os are available in this SoC part.For safe operation, it is advisable to utilize a power supply with 1.2V voltage.The SoCs wireless is considered unreliable if the voltage exceeds 1.26V.As long as it receives a power supply that is at least 1.14V, it should be able to function.A re-configurable FIELD PROGRAMMABLE GATE ARRAY can be used for a variety of designing purposes.Having 256 terminations in total makes system on a chip possible.As any high-quality Field Programmable Gate Arrays, it is a system on a chip of outstanding capabilities.Using this SoC chip, you have the option of having 138 outputs.A power supply of 1.2V is required to run system on chip.A SoC chip with 138 inputs is available.The logic SoC features 12084 logic cells.This flash has a size of 256KB.Furthermore, this SoC processor also incorporates additional features similar to LG-MIN, WD-MIN which are available on other SoC processors also.

ARM? Cortex?-M3 processor.


64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
LG-MIN, WD-MIN

There are a lot of Microsemi Corporation


M2S010TS-VFG256I System On Chip (SoC) applications.

  • Temperature Sensors
  • Communication interfaces ( I2C, SPI )
  • Functional safety for critical applications in the industrial sectors
  • Keywords
  • RISC-V
  • ARM
  • Smartphones
  • sequence controllers
  • Mouse
  • Cyber security for critical applications in the aerospace
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