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M2S010TS-VF400I

-40°C~100°C TJ System On ChipSmartFusion?2 Series 195 I/O

Manufacturer: Microsemi Corporation
Origchip NO: 523-M2S010TS-VF400I
Package: 400-LFBGA
Datasheet: PDF
Stock: 562
Description: -40°C~100°C TJ System On ChipSmartFusion?2 Series 195 I/O(Kg)

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Shipping Cost

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FedEx International, 5-7 business days.

The following are some common countries' logistic time.
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Details

Tags

Parameters
Factory Lead Time	10 Weeks
Package / Case	400-LFBGA
Supplier Device Package	400-VFBGA (17x17)
Operating Temperature	-40°C~100°C TJ
Packaging	Tray
Published	2015
Series	SmartFusion®2
Part Status	Active
Moisture Sensitivity Level (MSL)	3 (168 Hours)
Number of I/O	195
Speed	166MHz
RAM Size	64KB
Core Processor	ARM® Cortex®-M3
Peripherals	DDR, PCIe, SERDES
Connectivity	CANbus, Ethernet, I2C, SPI, UART/USART, USB
Architecture	MCU, FPGA
Primary Attributes	FPGA - 10K Logic Modules
Flash Size	256KB
RoHS Status	Non-RoHS Compliant

This SoC is built on ARM? Cortex?-M3 core processor(s).

A ARM? Cortex?-M3 core processor(s) is built into this SoC.Manufacturer assigns package 400-LFBGA to this system on a chip.Users will enjoy reliable performance with this SoC chip, which has implemented 64KB RAM.In terms of internal architecture, this SoC design uses the MCU, FPGA method.It is a member of the SmartFusion?2 series.Temperatures should be -40°C~100°C TJ on average for this SoC meaning.Taking note of the fact that this SoC security combines FPGA - 10K Logic Modules is important.Tray package houses this SoC system on a chip.This SoC part has a total of 195 I/Os.The flash size of the SoC meaning is 256KB.