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IDT72T51248L5BB

324 TerminationsFIFO memory IC5 ns


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Details

Tags

Parameters
Mount Surface Mount
Package / Case BGA
Published 2009
JESD-609 Code e0
Moisture Sensitivity Level (MSL) 3
Number of Terminations 324
ECCN Code EAR99
Terminal Finish Tin/Lead (Sn63Pb37)
Max Operating Temperature 70°C
Min Operating Temperature 0°C
HTS Code 8542.32.00.71
Subcategory FIFOs
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 225
Number of Functions 1
Supply Voltage 2.5V
Terminal Pitch 1mm
Reach Compliance Code not_compliant
Time@Peak Reflow Temperature-Max (s) 30
Pin Count 324
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 2.625V
Power Supplies 1.5/2.52.5V
Temperature Grade COMMERCIAL
Supply Voltage-Min (Vsup) 2.375V
Operating Mode SYNCHRONOUS
Clock Frequency 200MHz
Access Time 5 ns
Organization 32KX40
Memory Width 40
Memory Density 1310720 bit
Parallel/Serial PARALLEL
Memory IC Type OTHER FIFO
Output Enable YES
Height Seated (Max) 1.97mm
Length 19mm
Width 19mm
RoHS Status Non-RoHS Compliant

IDT72T51248L5BB Overview


BGA is a package that contains FIFO memory chip.It is pointing in the direction of Surface Mount .When the supply voltage is 2.5V , high efficiency is possible.In FIFO means, there are 324 terminations.The FIFO products must be run at a minimum temperature of 0°C degrees Celsius to ensure reliability.An operating temperature of 70°C °C is necessary for stable operation.The gadget in FIFOs is self-contained.ICs of type OTHER FIFO are used in the FIFO memory chip.Approximately 324 pins are attached to it.It is normal for the component to own 1.5/2.52.5V power supplies.There is a FIFO memory IC's maximum supply voltage of 2.625V (Vsup).Maintain the supply voltage (Vsup) above 2.375V for normal operation.The FIFO memory IC runs at a frequency of 200MHz .

IDT72T51248L5BB Features


FIFOs category
Clock frequency of 200MHz

IDT72T51248L5BB Applications


There are a lot of Integrated Device Technology (IDT) IDT72T51248L5BB FIFOs Memory applications.

  • Telecommunication
  • SPI Bus Flash Memory Device
  • Tape controllers
  • Extended product-change notification
  • General Data Collection Applications at Low-Temperatures
  • PC peripheral
  • Wireless
  • Temporary storage elements
  • Network bridges
  • Thermal Management for DDR3 Memory Modules
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