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IDT72T40118L4BBG

208 TerminationsFIFO memory IC4 ns

Manufacturer: Integrated Device Technology (IDT)
Origchip NO: 378-IDT72T40118L4BBG
Package: BGA
Datasheet: PDF
Stock: 637
Description: 208 TerminationsFIFO memory IC4 ns (Kg)

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Details

Tags

Parameters
Mount	Surface Mount
Package / Case	BGA
Published	2009
JESD-609 Code	e1
Moisture Sensitivity Level (MSL)	3
Number of Terminations	208
ECCN Code	EAR99
Terminal Finish	TIN SILVER COPPER
Max Operating Temperature	70°C
Min Operating Temperature	0°C
Additional Feature	ALTERNATIVE MEMORY WIDTH: 10 AND 20
HTS Code	8542.32.00.71
Technology	CMOS
Terminal Position	BOTTOM
Terminal Form	BALL
Peak Reflow Temperature (Cel)	260
Number of Functions	1
Supply Voltage	2.5V
Terminal Pitch	1mm
Time@Peak Reflow Temperature-Max (s)	30
Pin Count	208
Qualification Status	Not Qualified
Supply Voltage-Max (Vsup)	2.625V
Temperature Grade	COMMERCIAL
Supply Voltage-Min (Vsup)	2.375V
Operating Mode	SYNCHRONOUS
Access Time	4 ns
Organization	128KX40
Memory Width	40
Memory Density	5242880 bit
Parallel/Serial	PARALLEL
Output Enable	YES
Height Seated (Max)	1.97mm
Length	17mm
Width	17mm
RoHS Status	RoHS Compliant

IDT72T40118L4BBG Overview

BGA is a package that contains FIFO memory chip.Mounting it Surface Mount is recommended.When the supply voltage is 2.5V , high efficiency is possible.FIFO consists of 208 terminations, which indicates that FIFO means is empty.This FIFO products runs at 0°C degrees Celsius at a minimum temperature to ensure reliability.70°C °C is the memory logic's maximum operating temperature that allows stable operation.This FIFO memory IC is equipped with 208 pins in total.With the help of this FIFO memory, ALTERNATIVE MEMORY WIDTH: 10 AND 20 can also be generated.Voltage FIFO memory IC's maximum is set to 2.625V .The supply voltage (Vsup) should remain above 2.375V to ensure normal operation.