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CYP15G0201DXB-BBI

Telecom device2 Circuits

Manufacturer: Rochester Electronics, LLC
Origchip NO: 699-CYP15G0201DXB-BBI
Package: 196-LBGA
Datasheet: PDF
Stock: 388
Description: Telecom device2 Circuits(Kg)

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Shipping Cost

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The basic freight (for package ≤0.5kg or corresponding volume) depends on the time zone and country.

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Delivery Time

Once the goods are shipped, estimated delivery time depends on the shipping methods you chose:

FedEx International, 5-7 business days.

The following are some common countries' logistic time.
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Details

Tags

Parameters
Mounting Type	Surface Mount
Package / Case	196-LBGA
Supplier Device Package	196-FBGA (15x15)
Operating Temperature	-40°C~85°C
Packaging	Tray
Series	HOTlink II™
Part Status	Obsolete
Moisture Sensitivity Level (MSL)	3 (168 Hours)
Voltage - Supply	3.135V~3.465V
Function	Transceiver
Interface	LVTTL
Number of Circuits	2
Current - Supply	570mA
RoHS Status	Non-RoHS Compliant

CYP15G0201DXB-BBI Overview

The 196-LBGA package reduces the amount of space on a board.To pack telecommunications equipment, the way of Tray is used.A Surface Mount-mount is used for mounting the telecom circuit.There are 2 circuits in this telecom IC .Improved efficiency can be ensured when the supply voltage of 3.135V~3.465V is provided.Reliable performance can be offered when the operating temperature is set at -40°C~85°C.The supply current is 570mA.With its similar functionality to electronic parts under the HOTlink II? series, it can perform a number of similar tasks.