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BGB741L7ESDE6327XTSA1

BGB741L7ESDE6327XTSA1 datasheet pdf and RF Amplifiers product details from Infineon Technologies stock available at Feilidi

Manufacturer: Infineon Technologies
Origchip NO: 376-BGB741L7ESDE6327XTSA1
Package: 6-XFDFN Exposed Pad
Datasheet: PDF
Stock: 538
Description: BGB741L7ESDE6327XTSA1 datasheet pdf and RF Amplifiers product details from Infineon Technologies stock available at Feilidi (Kg)

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Once the goods are shipped, estimated delivery time depends on the shipping methods you chose:

FedEx International, 5-7 business days.

The following are some common countries' logistic time.
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Details

Tags

Parameters
Factory Lead Time	8 Weeks
Contact Plating	Tin
Mount	Surface Mount
Mounting Type	Surface Mount
Package / Case	6-XFDFN Exposed Pad
Number of Pins	6
Packaging	Tape & Reel (TR)
Published	2009
JESD-609 Code	e4
Part Status	Active
Moisture Sensitivity Level (MSL)	1 (Unlimited)
Terminal Finish	Gold (Au)
Max Operating Temperature	150°C
Min Operating Temperature	-55°C
Max Power Dissipation	120mW
Voltage - Supply	1.8V~4V
Construction	COMPONENT
Frequency	50MHz~3.5GHz
Test Frequency	1.5GHz
Current - Supply	30mA
Halogen Free	Halogen Free
Gain	19.5dB
RF/Microwave Device Type	WIDE BAND LOW POWER
RF Type	Cellular, RKE, WiFi
Input Power-Max (CW)	20dBm
Characteristic Impedance	50Ohm
Max Junction Temperature (Tj)	150°C
Noise Figure	1dB
P1dB	-6.5dBm
Height	500μm
Radiation Hardening	No
RoHS Status	ROHS3 Compliant
Lead Free	Lead Free