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BAP51-02,115

BAP51-02,115 datasheet pdf and Diodes - RF product details from NXP USA Inc. stock available at Feilidi

Manufacturer: NXP USA Inc.
Origchip NO: 568-BAP51-02,115
Package: SC-79, SOD-523
Datasheet: PDF
Stock: 885
Description: BAP51-02,115 datasheet pdf and Diodes - RF product details from NXP USA Inc. stock available at Feilidi (Kg)

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Details

Tags

Parameters
Factory Lead Time	13 Weeks
Package / Case	SC-79, SOD-523
Surface Mount	YES
Diode Element Material	SILICON
Operating Temperature	-65°C~150°C TJ
Packaging	Tape & Reel (TR)
JESD-609 Code	e3
Part Status	Active
Moisture Sensitivity Level (MSL)	1 (Unlimited)
Number of Terminations	2
Terminal Finish	Tin (Sn)
HTS Code	8541.10.00.70
Subcategory	PIN Diodes
Technology	POSITIVE-INTRINSIC-NEGATIVE
Terminal Position	DUAL
Terminal Form	FLAT
Peak Reflow Temperature (Cel)	260
Time@Peak Reflow Temperature-Max (s)	NOT SPECIFIED
Base Part Number	BAP51
Pin Count	2
JESD-30 Code	R-PDSO-F2
Qualification Status	Not Qualified
Number of Elements	1
Power Dissipation-Max	715mW
Diode Type	PIN - Single
Current - Max	50mA
Capacitance @ Vr, F	0.35pF @ 5V 1MHz
Voltage - Peak Reverse (Max)	60V
Breakdown Voltage-Min	60V
Diode Capacitance-Nom	0.4pF
Resistance @ If, F	2.5Ohm @ 10mA 100MHz
Diode Capacitance-Max	0.55pF
Diode Res Test Current	0.5mA
Diode Res Test Frequency	100MHz
RoHS Status	ROHS3 Compliant