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AD73311LARU

16 Bit 0.65mm AFE 3V 20-TSSOP (0.173, 4.40mm Width)


  • Manufacturer: Rochester Electronics, LLC
  • Origchip NO: 699-AD73311LARU
  • Package: 20-TSSOP (0.173, 4.40mm Width)
  • Datasheet: PDF
  • Stock: 451
  • Description: 16 Bit 0.65mm AFE 3V 20-TSSOP (0.173, 4.40mm Width) (Kg)

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Details

Tags

Parameters
Package / Case 20-TSSOP (0.173, 4.40mm Width)
Surface Mount YES
Packaging Tube
JESD-609 Code e0
Pbfree Code no
Part Status Obsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 20
Terminal Finish TIN LEAD
Power (Watts) 50mW
Technology CMOS
Terminal Position DUAL
Terminal Form GULL WING
Peak Reflow Temperature (Cel) 240
Number of Functions 1
Supply Voltage 3V
Terminal Pitch 0.65mm
Time@Peak Reflow Temperature-Max (s) 30
Pin Count 20
Qualification Status COMMERCIAL
Operating Temperature (Max) 105°C
Operating Temperature (Min) -40°C
Temperature Grade INDUSTRIAL
Number of Channels 2
Number of Bits 16
Voltage - Supply, Analog 3V
Telecom IC Type TELECOM CIRCUIT
Height Seated (Max) 1.1mm
Length 6.5mm
Width 4.4mm
RoHS Status Non-RoHS Compliant

AD73311LARU Overview


In this case, it is packaged in the same way as 20-TSSOP (0.173, 4.40mm Width).16 Bits were used to design this electronic part.As part of Tube, it is embedded.20 termination involves impedance-matching a transmission line.This electrical device provides regulated DC power to run a load based on the supply voltage (analog voltage) 3V, converted from AC voltage to DC voltage.As long as the supply voltage is kept at 3V, it is fine.The pin count is 20.As far as the power of this electrical device is concerned, it is 50mW Watts.Devices such as this must be operated at temperatures below 105°C in order to function properly.In this case, the telecom IC it adopts is TELECOM CIRCUIT.There should be a minimum operating temperature of -40°C.

AD73311LARU Features



AD73311LARU Applications


There are a lot of Rochester Electronics, LLC AD73311LARU AFE applications.

  • Communication test equipment
  • Automotive
  • Medical Imaging
  • Digital beam-forming systems for ultrasound
  • Imaging Systems
  • Multicarrier, multimode digital receivers
  • Displaying
  • Smart antenna systems
  • 3-phase power control
  • Digital signal processing
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