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A2F500M3G-1FGG484

0°C~85°C TJ 484 Pin A2F500M3G System On ChipSmartFusion? Series MCU - 41, FPGA - 128 I/OMin 1.425V VMax 1.575V V


  • Manufacturer: Microsemi Corporation
  • Origchip NO: 523-A2F500M3G-1FGG484
  • Package: 484-BGA
  • Datasheet: PDF
  • Stock: 955
  • Description: 0°C~85°C TJ 484 Pin A2F500M3G System On ChipSmartFusion? Series MCU - 41, FPGA - 128 I/OMin 1.425V VMax 1.575V V(Kg)

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Details

Tags

Parameters
Factory Lead Time 12 Weeks
Mount Surface Mount
Package / Case 484-BGA
Number of Pins 484
Supplier Device Package 484-FPBGA (23x23)
Operating Temperature 0°C~85°C TJ
Packaging Tray
Published 2011
Series SmartFusion®
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Max Operating Temperature 85°C
Min Operating Temperature 0°C
Frequency 100MHz
Base Part Number A2F500M3G
Operating Supply Voltage 1.5V
Interface EBI/EMI, Ethernet, I2C, SPI, UART, USART
Max Supply Voltage 1.575V
Min Supply Voltage 1.425V
Memory Size 13.5kB
Operating Supply Current 16.5mA
Number of I/O MCU - 41, FPGA - 128
Speed 100MHz
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DMA, POR, WDT
Connectivity EBI/EMI, Ethernet, I2C, SPI, UART/USART
Data Rate 400 kbps
Architecture MCU, FPGA
Number of Logic Elements/Cells 5500
Core Architecture ARM
Number of Gates 500000
Max Frequency 120MHz
Speed Grade 1
Primary Attributes ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops
Number of Registers 11520
Flash Size 512KB
Radiation Hardening No
RoHS Status RoHS Compliant

This SoC is built on ARM? Cortex?-M3 core processor(s).


A core processor ARM? Cortex?-M3 is used to build this SoC.According to the manufacturer, this system on a chip has a package of 484-BGA.The 64KB RAM implementation of this SoC chip ensures efficient performance for users.In terms of internal architecture, this SoC design uses the MCU, FPGA method.SmartFusion? is the series name of this system on chip SoC.It is recommended that this SoC meaning be operated at 0°C~85°C TJ on an average.One important thing to mark down is that this SoC meaning combines ProASIC?3 FPGA, 500K Gates, 11520 D-Flip-Flops.This SoC system on a chip has been designed in a state-of-the-art Tray package.MCU - 41, FPGA - 128 I/Os in total are included in this SoC part.This flash has a size of 512KB.You can get system on chips with similar specs and purposes by searching A2F500M3G.100MHz is the wireless SoC's frequency.In terms of core architecture, the SoC meaning relies on ARM.This is the version with 484 pins.It just takes 0°C for the SoC computing to start up, and that is all it needs.This SoC system on chip operates at a maximum design temperature of 85°C.The maximum supply voltage is rated as 1.575V.It is supplied with at least 1.425V power.

ARM? Cortex?-M3 processor.


64KB RAM.
Built on MCU, FPGA.
512KB extended flash.
Core Architecture: ARM

There are a lot of Microsemi Corporation


A2F500M3G-1FGG484 System On Chip (SoC) applications.

  • Temperature
  • Industrial transport
  • Samsung galaxy gear
  • Networked sensors
  • ARM support modules
  • Apple smart watch
  • Remote control
  • Functional safety for critical applications in the aerospace
  • Medical
  • Sensor network-on-chip (sNoC)
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