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A2F200M3F-1FG256

256 Terminations0°C~85°C TJ 256 Pin A2F200 System On ChipSmartFusion? Series MCU - 25, FPGA - 66 I/O1.5V


  • Manufacturer: Microsemi Corporation
  • Origchip NO: 523-A2F200M3F-1FG256
  • Package: 256-LBGA
  • Datasheet: PDF
  • Stock: 682
  • Description: 256 Terminations0°C~85°C TJ 256 Pin A2F200 System On ChipSmartFusion? Series MCU - 25, FPGA - 66 I/O1.5V (Kg)

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Details

Tags

Parameters
Factory Lead Time 12 Weeks
Package / Case 256-LBGA
Surface Mount YES
Number of Pins 256
Operating Temperature 0°C~85°C TJ
Packaging Tray
Published 2009
Series SmartFusion®
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 256
Terminal Finish TIN LEAD/TIN LEAD SILVER
Subcategory Field Programmable Gate Arrays
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 225
Supply Voltage 1.5V
Terminal Pitch 1mm
Frequency 100MHz
Time@Peak Reflow Temperature-Max (s) 30
Base Part Number A2F200
Number of Outputs 66
Supply Voltage-Max (Vsup) 1.575V
Supply Voltage-Min (Vsup) 1.425V
Interface EBI/EMI, Ethernet, I2C, SPI, UART, USART
Operating Supply Current 3mA
Number of I/O MCU - 25, FPGA - 66
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DMA, POR, WDT
Connectivity EBI/EMI, Ethernet, I2C, SPI, UART/USART
Architecture MCU, FPGA
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Core Architecture ARM
Number of Gates 200000
Number of Logic Blocks (LABs) 8
Primary Attributes ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops
Flash Size 256KB
Height Seated (Max) 1.7mm
Length 17mm
Width 17mm
Radiation Hardening No
RoHS Status Non-RoHS Compliant

This SoC is built on ARM? Cortex?-M3 core processor(s).


On this SoC, there is ARM? Cortex?-M3 core processor.Its package is 256-LBGA.As this SoC chip has 64KB RAM implemented, it provides reliable performance to its users.In terms of internal architecture, this SoC design uses the MCU, FPGA method.It is a member of the SmartFusion? series.For this SoC meaning, the average operating temperature should be 0°C~85°C TJ.As one of the most important things to note is that this SoC security combines ProASIC?3 FPGA, 200K Gates, 4608 D-Flip-Flops together.Tray package houses this SoC system on a chip.As a whole, this SoC part is comprised of MCU - 25, FPGA - 66 inputs and outputs.As a rule of thumb, it is advised to use a power supply with a value of 1.5V.It is considered hazardous to operate the SoCs wireless with a voltage higher than 1.575V.In order to run it, it must be fed by at least 1.425V of power.You can reconfigure FIELD PROGRAMMABLE GATE ARRAY to meet your specific design needs.As a result, there are 256 terminations in total, which does really benefit system on a chip.In addition, it boasts impressive system on a chipming capabilities, just like other high-quality Field Programmable Gate Arrays.In order for this SoC chip to work properly, you can have 66 outputs.The flash is set to 256KB.A2F200 can help you find system on chips with similar specs and purposes.A frequency of 100MHz is used by the wireless SoC to operate.In terms of core architecture, the SoC meaning relies on ARM.The computer SoC is the 256-pin version.

ARM? Cortex?-M3 processor.


64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
Core Architecture: ARM

There are a lot of Microsemi Corporation


A2F200M3F-1FG256 System On Chip (SoC) applications.

  • High-end PLC
  • Efficient hardware for training of neural networks
  • Measurement tools
  • Microcontroller
  • Optical drive
  • Mobile computing
  • Special Issue Editors
  • RISC-V
  • Multiprocessor system-on-chips (MPSoCs)
  • Vending machines
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