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10AS032E3F29E2SG

780 Terminations0°C~100°C TJ System On ChipArria 10 SX Series 360 I/O0.9V


  • Manufacturer: Intel
  • Origchip NO: 386-10AS032E3F29E2SG
  • Package: 780-BBGA, FCBGA
  • Datasheet: PDF
  • Stock: 410
  • Description: 780 Terminations0°C~100°C TJ System On ChipArria 10 SX Series 360 I/O0.9V (Kg)

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Details

Tags

Parameters
Factory Lead Time 8 Weeks
Package / Case 780-BBGA, FCBGA
Surface Mount YES
Operating Temperature 0°C~100°C TJ
Packaging Tray
Series Arria 10 SX
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 780
HTS Code 8542.39.00.01
Subcategory Field Programmable Gate Arrays
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 0.9V
Terminal Pitch 1mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code S-PBGA-B780
Number of Outputs 360
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 0.93V
Power Supplies 0.9V
Supply Voltage-Min (Vsup) 0.87V
Number of I/O 360
Speed 1.5GHz
RAM Size 256KB
Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Peripherals DMA, POR, WDT
Connectivity EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Number of Inputs 360
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Primary Attributes FPGA - 320K Logic Elements
Number of Logic Cells 320000
Height Seated (Max) 3.35mm
Length 29mm
Width 29mm
RoHS Status RoHS Compliant

This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).


Based on the core processor(s) Dual ARM? Cortex?-A9 MPCore? with CoreSight?, this SoC has been developed.The manufacturer assigns this system on a chip with a 780-BBGA, FCBGA package as per the manufacturer's specifications.The SoC chip provides users with reliable performance because it is implemented with 256KB RAM.A MCU, FPGA technique is used for the SoC design's internal architecture.It is a member of the Arria 10 SX series.For this SoC meaning, the average operating temperature should be 0°C~100°C TJ.This SoC security combines FPGA - 320K Logic Elements and that is something to note.A state-of-the-art Tray package houses this SoC system on a chip.360 I/Os are available in this SoC part.A 0.9V power supply should be used.The SoCs wireless cannot operate at a voltage greater than 0.93V because it is considered unsafe for the application.At least 0.87V can be supplied as a power source.Depending on your specific needs, FIELD PROGRAMMABLE GATE ARRAY can be re-configured.Having 780 terminations in total makes system on a chip possible.Just like other high-quality Field Programmable Gate Arrays will do, it is of outstanding system on a chip capability.A SoC chip like this can have 360 outputs.A power supply of 0.9V is required.A SoC chip with 360 inputs is available to the user.In logic system on chips, there are 320000 logic cells.

Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.


256KB RAM.
Built on MCU, FPGA.

There are a lot of Intel


10AS032E3F29E2SG System On Chip (SoC) applications.

  • Mobile computing
  • Smartphones
  • Digital Signal Processing
  • Sports
  • RISC-V
  • System-on-chip (SoC)
  • Measurement tools
  • Industrial automation devices
  • Medical
  • Healthcare
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