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10018783-11212TLF

10018783-11212TLF datasheet pdf and Card Edge Connectors - Edgeboard Connectors product details from Amphenol ICC (FCI) stock available at XINJIADA

Manufacturer: Amphenol ICC (FCI)
Origchip NO: 44-10018783-11212TLF
Package: -
Datasheet: PDF
Stock: 126
Description: 10018783-11212TLF datasheet pdf and Card Edge Connectors - Edgeboard Connectors product details from Amphenol ICC (FCI) stock available at XINJIADA(Kg)

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Details

Tags

Parameters
Factory Lead Time	11 Weeks
Contact Material	Copper Alloy
Contact Plating	Gold
Mount	Through Hole
Mounting Type	Through Hole
Housing Material	Nylon
Material - Insulation	Polyamide (PA), Nylon, Glass Filled
Operating Temperature	-55°C~85°C
Packaging	Tray
Series	HPCE®
Feature	Board Lock, Locking Ramp
Part Status	Active
Moisture Sensitivity Level (MSL)	1 (Unlimited)
Termination	Solder, Staggered
Connector Type	Cantilever
Number of Positions	98
Max Operating Temperature	85°C
Min Operating Temperature	-55°C
Color	Black
Number of Rows	2
Gender	Female
Contact Type	Cantilever
Pitch	0.039 1.00mm
Orientation	Straight
Current Rating	1.1A
Contact Finish	Gold
Voltage - Rated AC	300V
Number of Contacts	98
Housing Color	Black
Card Type	PCI Express™
Read Out	Dual
Insulation Resistance	1GOhm
Max Voltage Rating (AC)	300V
Length	56mm
Width	7.4mm
Contact Finish Thickness	Flash
Card Thickness	0.062 1.57mm
Board Thickness	2.36mm
RoHS Status	RoHS Compliant
Flammability Rating	UL94 V-0
Lead Free	Lead Free

10018783-11212TLF Overview

It was packaged based on Tray's specs.Mounting type Through Hole is recommended.Connecting the device uses the connector socket Cantilever.This device has Board Lock, Locking Ramp features.HPCE? tells you what series the device is.Keeping the temperature below 85°C°C will make it stable.In order to ensure their reliability, they require a minimum working temperature of -55°C degrees Celsius.