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10018783-11210TLF

10018783-11210TLF datasheet pdf and Card Edge Connectors - Edgeboard Connectors product details from Amphenol ICC (FCI) stock available at XINJIADA

Manufacturer: Amphenol ICC (FCI)
Origchip NO: 44-10018783-11210TLF
Package: -
Datasheet: PDF
Stock: 788
Description: 10018783-11210TLF datasheet pdf and Card Edge Connectors - Edgeboard Connectors product details from Amphenol ICC (FCI) stock available at XINJIADA(Kg)

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Details

Tags

Parameters
Contact Finish	Gold
Voltage - Rated AC	300V
Number of Contacts	36
Housing Color	Black
Card Type	PCI Express™
Read Out	Dual
Insulation Resistance	1GOhm
Max Voltage Rating (AC)	300V
Length	25mm
Width	7.4mm
Contact Finish Thickness	Flash
Card Thickness	0.062 1.57mm
Board Thickness	2.36mm
RoHS Status	RoHS Compliant
Flammability Rating	UL94 V-0
Lead Free	Lead Free
Factory Lead Time	11 Weeks
Contact Material	Copper Alloy
Contact Plating	Gold
Mount	Through Hole
Mounting Type	Through Hole
Housing Material	Nylon
Material - Insulation	Polyamide (PA), Nylon, Glass Filled
Operating Temperature	-55°C~85°C
Packaging	Tray
Series	HPCE®
Feature	Board Lock, Locking Ramp
Part Status	Active
Moisture Sensitivity Level (MSL)	1 (Unlimited)
Termination	Solder, Staggered
Connector Type	Cantilever
Number of Positions	36
Max Operating Temperature	85°C
Min Operating Temperature	-55°C
Color	Black
Number of Rows	2
Gender	Female
Contact Type	Cantilever
Pitch	0.039 1.00mm
Orientation	Straight
Current Rating	1.1A

10018783-11210TLF Overview

Tray wanted the material packaged as per his specs.It is recommended to mount the device using type Through Hole.Devices are connected through connector sockets Cantilever.There are Board Lock, Locking Ramp features on this device.HPCE? means it's a series device.Operating at a maximum temperature of 85°C°C ensures stable performance.A minimum working temperature of -55°C degrees Celsius is required to ensure its reliability.