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SY100EP16VSKY-TR

Differential Receiver/Driver -40°C~85°C Specialty Logic IC 100EP Series 100EP16 3V~5.5V 8-TSSOP, 8-MSOP (0.118, 3.00mm Width) Exposed Pad


  • Manufacturer: Microchip Technology
  • Origchip NO: 536-SY100EP16VSKY-TR
  • Package: 8-TSSOP, 8-MSOP (0.118, 3.00mm Width) Exposed Pad
  • Datasheet: PDF
  • Stock: 506
  • Description: Differential Receiver/Driver -40°C~85°C Specialty Logic IC 100EP Series 100EP16 3V~5.5V 8-TSSOP, 8-MSOP (0.118, 3.00mm Width) Exposed Pad (Kg)

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Shipping Cost

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The basic freight (for package ≤0.5kg or corresponding volume) depends on the time zone and country.

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Delivery Time

Once the goods are shipped, estimated delivery time depends on the shipping methods you chose:

FedEx International, 5-7 business days.

The following are some common countries' logistic time.
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Details

Tags

Parameters
Mounting Type Surface Mount
Package / Case 8-TSSOP, 8-MSOP (0.118, 3.00mm Width) Exposed Pad
Supplier Device Package 8-MSOP-EP
Operating Temperature -40°C~85°C
Packaging Tape & Reel (TR)
Published 2006
Series 100EP
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Supply Voltage 3V~5.5V
Base Part Number 100EP16
Logic Type Differential Receiver/Driver
RoHS Status ROHS3 Compliant

SY100EP16VSKY-TR Overview


It is used to package items using Tape & Reel (TR).There is a 8-TSSOP, 8-MSOP (0.118, 3.00mm Width) Exposed Pad package containing it.The voltage of 3V~5.5V ensures that the device can operate normally.Electronic parts mounted using the Surface Mount method.It is set to operate at a temperature of -40°C~85°C.Several similarities exist among electronic parts of the 100EP series.In addition to its base part number 100EP16, other related parts are available.

SY100EP16VSKY-TR Features



SY100EP16VSKY-TR Applications


There are a lot of Microchip Technology SY100EP16VSKY-TR Specialty Logic ICs applications.

  • Fast Ethernet
  • Switching system
  • Low power, low voltage systems
  • Precision engineering measurement
  • Relays
  • Desktop PC
  • Wireless showroom
  • Thermal management
  • Optical sub-assembly (OSA)
  • Cell phones
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