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10018784-10202MLF

10018784-10202MLF datasheet pdf and Card Edge Connectors - Edgeboard Connectors product details from Amphenol ICC (FCI) stock available at XINJIADA


  • Manufacturer: Amphenol ICC (FCI)
  • Origchip NO: 44-10018784-10202MLF
  • Package: -
  • Datasheet: PDF
  • Stock: 639
  • Description: 10018784-10202MLF datasheet pdf and Card Edge Connectors - Edgeboard Connectors product details from Amphenol ICC (FCI) stock available at XINJIADA(Kg)

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Details

Tags

Parameters
Factory Lead Time 11 Weeks
Contact Material Copper Alloy
Contact Plating GXT, Gold, Tin
Mount Through Hole
Mounting Type Through Hole
Housing Material Nylon
Material - Insulation Polyamide (PA), Nylon, Glass Filled
Operating Temperature -55°C~85°C
Packaging Tray
Published 2015
Feature Board Guide, Locking Ramp
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder, Staggered
Number of Positions 98
Max Operating Temperature 85°C
Min Operating Temperature -55°C
Color Black
Number of Rows 2
Gender Female
Pitch 0.039 1.00mm
Orientation Straight
Current Rating 1.1A
Contact Finish Gold or Gold, GXT™
Voltage - Rated AC 300V
Housing Color Black
Card Type PCI Express™
Read Out Dual
Insulation Resistance 1GOhm
Max Voltage Rating (AC) 300V
Contact Finish Thickness Flash
Card Thickness 0.062 1.57mm
Board Thickness 1.56mm
RoHS Status RoHS Compliant

10018784-10202MLF Overview


The material was packaged according to the specifications provided by Tray.A mounting type of Through Hole is recommended.A device with Board Guide, Locking Ramp features is available.For stable operation, a maximum operating temperature of 85°C°C should be considered.It has to work at a minimum temperature of -55°C degrees Celsius.

10018784-10202MLF Features



10018784-10202MLF Applications


There are a lot of Amphenol ICC (FCI) 10018784-10202MLF Edgeboard Connectors applications.

  • Digital Storage Oscilloscope
  • Communication Systems
  • RADAR processing, digital oscilloscopes
  • Wireless and wired broadband communications
  • Data Acquisition Systems
  • Music reproduction technology
  • Cell Phones
  • Automotive
  • CMOS Image sensors for mobile applications
  • Micro and pico cell systems, software radios
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